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Toshiba Personal Computer TECRA M11/Satellite Pro S500M Series Maintenance Manual First edition April 2010 TOSHIBA CORPORATION File Number 960-813 [CONFIDENTIAL]...
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NOTE: “Note” contains general information that relates to your safe maintenance service. Improper repair of the computer may result in safety hazards. Toshiba requires service technicians and authorized dealers or service providers to ensure the following safety precautions are adhered to strictly.
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The manual is divided into the following parts: Chapter 1 Hardware Overview describes the Qosmio F60 Series system unit and each FRU. Chapter 2 Troubleshooting Procedures explains how to diagnose and resolve FRU problems. Chapter 3 Test and Diagnostics describes how to perform test and diagnostic operations for maintenance service.
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Conventions This manual uses the following formats to describe, identify, and highlight terms and operating procedures. Acronyms On the first appearance and whenever necessary for clarification acronyms are enclosed in parentheses following their definition. For example: Read Only Memory (ROM) Keys Keys are used in the text to describe many operations.
Table of Contents Chapter 1 Hardware Overview Features ........................1-5 System Unit Block Diagram ..................1-12 3.5-inch Floppy Disk Drive (USB External) ............1-20 2.5-inch Hard Disk Drive..................1-21 Optical Drive (ODD) ....................1-23 1.5.1 DVD-ROM Drive ....................1-23 1.5.2 DVD-Super Multi Drive ..................1-24 Keyboard........................
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Chapter 2 Troubleshooting Procedures Troubleshooting ......................2-6 Troubleshooting Flowchart..................2-8 Power Supply Troubleshooting................2-13 System Board Troubleshooting................2-22 USB FDD Troubleshooting ..................2-30 2.5” HDD Troubleshooting..................2-34 Keyboard Troubleshooting ..................2-39 Touch pad or Dual point Troubleshooting............... 2-40 Display Troubleshooting..................2-42 2.10 Optical Disk Drive Troubleshooting................
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Chapter 3 Tests and Diagnostics The Diagnostic Test ....................3-7 Executing the Diagnostic Test ................. 3-10 Setting of the hardware configuration ..............3-15 Heatrun Test......................3-17 Subtest Names......................3-18 System Test......................3-20 Keyboard Test......................3-23 Display Test ......................3-24 Floppy Disk Test...................... 3-27 3.10 Printer Test.......................
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3.33 . Starting TOSHIBA Test & Diagnostic ..............3-96 3.34 . Windows PE T&D ....................3-98 3.35 DOS T&D ......................3-144 3.36 Maintenance (WinPE&FreeDos) Test Program Supplementary Information ..3-172 3.37 Maintenance (WinPE&FreeDos) Test Program Supplementary Information ..3-175 Chapter 4 Replacement Procedures Overview........................
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Appendices Appendix A Handling the LCD Module ................A-1 Appendix B Board Layout ....................B-1 Appendix C Pin Assignments.................... C-1 Appendix D Keyboard Scan/Character Codes ..............D-1 Appendix E Key Layout.....................E-1 Appendix F Wiring Diagrams.................... F-1 Appendix G BIOS rewrite Procedures ................G-1 Appendix H EC/KBC rewrite Procedures .................
1 Hardware Overview Chapter 1 Hardware Overview TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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1 Hardware Overview TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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1 Hardware Overview Chapter 1 Contents Chapter 1 Hardware Overview..................1 Features ......................... 5 System Unit Block Diagram ..................12 3.5-inch Floppy Disk Drive (USB External) .............. 20 2.5-inch Hard Disk Drive.................... 21 Optical Drive (ODD) ....................23 1.5.1 DVD-ROM Drive.................. 23 1.5.2 DVD-Super Multi Drive................
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1 Hardware Overview Figures Figure 1-1 Front of the computer................... 10 Figure 1-2 System unit configurations................... 11 Figure 1-3 System unit block diagram (case of 10, 10c model) ......... 12 Figure 1-4 System unit block diagram (case of 10GC model) ..........13 Figure 1-5 3.5-inch FDD (USB External)................
This computer incorporates the following features. There some models and options. Refer to the Parts List for the configuration of each model and options. Microprocessor The Toshiba TECRA M11/Satellite Pro S500M Series computer is equipped with an ® Intel Processor.
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1 Hardware Overview Chipset Toshiba TECRA M11/Satellite Pro S500M Series computer is Equipped with Intel Ibex peak-M QM57 or HM55. VGA Controller The PC comes in with one of the following two types: The internal graphics controller in Intel Processor (Core i*) is used..
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1 Hardware Overview TOSHIBA Dual Pointing Device The TOSHIBA Dual Pointing Device consists of Touch Pad and AccuPoint. The touch pad and control buttons enable control of the on-screen pointer and scrolling of windows. The pointer control stick and AccuPoint enables convenient control of the cursor.
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1 Hardware Overview SmartCard Slot This slot can accommodate a single Smart Card device. Some models are equipped with a Smart Card slot. Fingerprint sensor(Some models) The computer is equipped with a fingerprint sensor and fingerprint authentication utility. They enable only person who has registered his/her fingerprint to use the computer.
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Web Camera is a device that allows you to record video or take photographs with your computer. You can use it for video chatting or video conferences using a communication tool such as Windows Live Messenger. TOSHIBA Web Camera Application will help you to add various video effects to your video or photograph.
1 Hardware Overview The system unit configuration is shown in figure 1-2 Figure 1-2 System unit configurations TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 1-11...
1 Hardware Overview System Unit Block Diagram Figure 1-4 and 1-5 is a block diagram of the system unit. ) Figure 1-3 System unit block diagram (case of 10, 10c model 1-12 TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
1 Hardware Overview Figure 1-4 System unit block diagram (case of 10GC model) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 1-13...
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1 Hardware Overview The system unit is composed of the following major components: Microprocessor The Toshiba TECRA M11/Satellite Pro S500M Series computer is equipped with an ® Intel Processor. The PC comes in with one of the following speeds: Intel®...
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1 Hardware Overview Chipset Toshiba TECRA M11/Satellite Pro S500M Series computer is Equipped with Intel Ibex peak-M QM57 or HM55. Intel PCH (Processor Control HUB) North Bridge:Intel MontaraGM+ Banias Processor System Bus support DRAM control : DDR333/DDR266 support and 2GBmax ...
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1 Hardware Overview CardBus / PC card controller (Yenta2 Ver.2.2) SD card controller (SDHC Ver.1.2) A SD IO card controller (Ver.1.0) SmartMedia Controller (SMHC Ver.01/SMIL1.0) (it is not used in Spa) SIO (UART) controller (MS Debug Port Specification ver.1.0) ...
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1 Hardware Overview Modem Controller One MDC is used. Product made from Askey MDC1.5 (Azalia) This controller has the following functions: One RJ11 port V.92 (V.90) 56K Modem/FAX Ring Wakeup support Wireless LAN One PCI Express Mini Card slot1 802.11 a/b/g/n Intel 802.11(a/b/g/n)13ch-PP 2x2 MOW-HMC Atheros 802.11 a/b/g/n Atheros 802.11(a/b/g/n) 13ch-HB92 MOW-HMC Atheros 802.11 b/g/n...
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1 Hardware Overview Bridge Media Controller slot Card slotx1 SD, mini SD (w/ adapter),Micro SD (w/adapter),xD, MMC,Memory Stick,Memory Stick Pro,Memory Stick Duo (w/ adapter), Memory Stick Pro Duo (w/ adapter),Memory Stick Micro (w/ adapter) SD Token KEY, SD boot correspondence ...
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Clock generator: ICS9LVRS394CKLFT (Made by Integrated Device Technology) EC/KBC: MEC1609-PZP(REVISION.D) (Made by standard micro system) GPIO Expander: ECE1088-DZK (Made by standard micro system) PSC: TMP86FS49BUG (made by Toshiba) TPM: SLB9635 TT 1.2 (made by Infineon) ...
1 Hardware Overview 3.5-inch Floppy Disk Drive (USB External) The 3.5-inch FDD is a thin, high-performance reliable drive that supports 720KB (formatted) 2DD and 1.44MB (formatted) 2HD disks. The FDD is shown in figure 1-4. The specifications for the FDD are listed in Table 1-1. Figure 1-5 3.5-inch FDD (USB External) Table 1-1 3.5-inch FDD specifications TEAC FD-05PUB-337...
1 Hardware Overview 2.5-inch Hard Disk Drive The removable HDD is a random access non-volatile storage device. It has a non-removable 2.5-inch magnetic disk and mini-Winchester type magnetic heads. The computer supports a 160GB, 250GB or 320GB. The HDD is shown in figure 1-5. Specifications are listed in Table 1-2. Figure 1-6 2.5-inch HDD Table 1-2 2.5-inch HDD specifications Specifications...
(Gbit/sec) Data buffer size (MB/s) Positioning Time(read Read: 12ms and seek time) Motor startup time (s) Item Specifications Maker Merker Code Parts Code 2.5"SDD 128GB TOSHIBA THNS128GG4BBAA G8BC00062120 SATA 9.5mm 1-22 TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
1 Hardware Overview Optical Drive (ODD) 1.5.1 DVD-ROM Drive The DVD-ROM drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) DVD-ROM. The specifications of the DVD-ROM are described in Table 1-3. Table 1-4 DVD-ROM drive specifications Specifications Item TEAC DV-28S-WTA4 (G8CC0004QZ20) Outline Width (mm) 128 (excluding projections)
1 Hardware Overview 1.5.2 DVD-Super Multi Drive The DVD Super Multi drive accommodates either 12 cm (4.72-inch) or 8 cm (3.15-inch) CD- ROM, DVD-ROM, CD-R, CD-RW, DVD-R, DVD+R, DVD-RW, DVD+RW, DVD-RAM, DVD-R DL and DVD+R DL. The specifications are listed in Table 1-5. Figure 1-7 DVD Super Multi drive 1-24 TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
1 Hardware Overview Keyboard The keyboard is mounted 85(US)/87(UK) keys that consist of character key and control key, and in conformity with JIS. The keyboard is connected to membrane connector on the system board and controlled by the keyboard controller. Figure 1-7 is a view of the keyboard.
1 Hardware Overview TFT Color Display The TFT color display consists of 14.0-inch HD /HD+ LCD module. 1.7.1 LCD Module The LCD module used for the TFT color display uses a backlight as the light source and can display a maximum of 16M colors with 1,366 x 768 or 1,600 x 900 resolutions. Figure 1-8 shows a view of the LCD module and Table 1-6 lists the specifications.
1 Hardware Overview Power Supply The power supply supplies many different voltages to the system board and performs the following functions: 1. Judges that the DC power supply (AC adapter) is connected to the computer. 2. Detects DC output and circuit malfunctions. 3.
1 Hardware Overview Table 1-7 Power supply output rating ACPI S4/S5 S4/S5 S4/S5 state M state Moff Moff Moff Moff Wakeup Powe Voltag Name Object r line e [V] name × × × × × × × Processor IGD-PGV × ×...
1 Hardware Overview Batteries The computer has three types of batteries as follows: Main battery pack RTC battery The battery specifications are listed in Table 1-9. Table 1-8 Battery specifications Battery name Material Output Capacity voltage battery G71C000AG310 48Wh, 6 cell Main G71C000AG110...
1 Hardware Overview 1.9.2 Battery Charging Control Battery charging is controlled by a power supply microprocessor. The microprocessor controls whether the charge is on or off and detects a full charge when the AC adaptor and battery are attached to the computer. The system charges the battery. Battery Charge When the AC adaptor is attached, there are two types of charge: When the system is powered off and when the system is powered on.
1 Hardware Overview Data preservation time When turning off the power in being charged fully, the preservation time is as following Table 1-11. Table 1-10 Data preservation time Condition preservation time Standby About 3 days Battery(48Wh, 6 cell) Shutdown About 35 days Battery(48Wh, 6 cell) Standby About 3 days 55Wh, 6 cell)
1 Hardware Overview 1.10 AC Adapter The AC adapter is also used to charge the battery. Table 1-13 lists the AC adapter specifications. Table 1-12 AC adapter specifications Parameter Specification G71C000A5210 (2-pin) G71C000A6210 (3-pin) Power 75W (Peak 90W) Input voltage 100V/240V Input frequency 50Hz to 60Hz...
1. Phillips screwdrivers (For replacement procedures) 2. Implements for debugging port check Toshiba MS-DOS system FD RS-232C cross cable Test board with debug port test cable PC for displaying debug port test result...
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Troubleshooting Procedures There are following two types of connections in the figure of board and module connection in and after 2.3 Power Supply Troubleshooting. (1) Cable connection is described in the figure as line. (2) Pin connection is described in the figure as arrow. <e.g>...
Before going through the flowchart steps, verify the following: Ask him or her to enter the password if a password is registered. Verify with the customer that Toshiba Windows is installed on the hard disk. Non- Windows operating systems can cause the computer to malfunction.
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Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (1/2) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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Troubleshooting Procedures Figure 2-1 Troubleshooting flowchart (2/2) 2-10 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Troubleshooting Procedures If the diagnostics program cannot detect an error, the problem may be intermittent. The Test program should be executed several times to isolate the problem. Check the Log Utilities function to confirm which diagnostic test detected an error(s), then perform the appropriate troubleshooting procedures as follows: 1.
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Troubleshooting Procedures 15. If a malfunction is detected on the fingerprint sensor, perform the Fingerprint Sensor Troubleshooting Procedures in Section 2.18. 16. If a malfunction is detected on the Web camera, perform the Web camera Troubleshooting Procedures in Section 2.19. 2-12 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Troubleshooting Procedures Power Supply Troubleshooting The power supply controller controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continue with the other Procedures as instructed. The procedures described in this section are: Procedure 1: Power Status Check Procedure 2: Error Code Check Procedure 3: Connection Check...
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Troubleshooting Procedures Table 2-2 DC IN icon DC IN icon Power supply status Lights blue DC power is being supplied from the AC adapter. Blinks orange Power supply malfunction Doesn’t light Any condition other than those above. *1 When the power supply controller detects a malfunction, the DC IN icon blinks orange.
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Troubleshooting Procedures 2.3.2 Procedure 2 Error Code Check If the power supply microprocessor detects a malfunction, the DC IN icon blinks orange. The blink pattern indicates an error as shown below. Start Off for 2 seconds Error code (8 bit) “1”...
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Troubleshooting Procedures Check 1 Convert the DC IN icon blink pattern into the hexadecimal error code and compare it to the tables below. Then go to Check 2. Table 2-3 Error code Error code Where error occurs DC Power (AC Adapter) Main battery 2nd battery S3V output...
Troubleshooting Procedures Main Battery Error code Meaning Main battery discharge current is over 0.5A. Main battery charge current is over 4.3A. The compensation value of [0A] is not within the limits from design data (± 400mA). Main battery charge current is over 0.3A when the charging is off. Unusual voltage occurred during Main battery charge.
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Troubleshooting Procedures E3V output Error code Meaning E3V voltage is over 3.96V. E3V voltage is under 2.81V when the computer is powered on. E3V voltage is under 2.81V when the computer is booting up. E3V voltage is under 2.81V when EV power is maintained. ...
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Troubleshooting Procedures 1R05-E1V output Error code Meaning 1R05-E1V voltage is over 1.26V. 1R05-E1V voltage is under 0.89V when the computer is powered on. 1R05-E1V voltage is under 0.89V when the computer is booting up. 1R05-E1V voltage is under 1.26V when EV power is maintained. ...
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Troubleshooting Procedures Check 2 In the case of error code 10h or 12h: Make sure the AC adapter and AC power cord are firmly plugged into the DC IN 15 V socket and wall outlet. If the cables are connected firmly, go to the following step.
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Troubleshooting Procedures 2.3.4 Procedure 4 Charging Check Check if the power supply controller charges the battery pack properly. Perform the following procedures: Check 1 Make sure the AC adapter is firmly plugged into the DC IN jack. Check 2 Make sure the battery pack is properly installed. If it is properly installed, go to Check 3.
Troubleshooting Procedures System Board Troubleshooting This section describes how to determine if the system board is malfunctioning or not. Start with Procedure 1 and continue with the other procedures as instructed. The procedures described in this section are: Procedure 1: Message Check Procedure 2: Debugging Port Check Procedure 3: Diagnostic Test Program Execution Check Procedure 4: Replacement Check...
Troubleshooting Procedures 2.4.1 Procedure 1 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. The IRT tests each IC on the system board and initializes it. If an error message is shown on the display, perform Check 1. ...
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Troubleshooting Procedures If any other error message displays, perform Check 3. Check 3 The IRT checks the system board. When the IRT detects an error, the system stops or an error message appears. If one of the following error messages (1) through (17), (23) or (24) is displayed, go to Procedure 4.
Troubleshooting Procedures 2.4.2 Procedure 2 Debugging Port Check Check the D port status by a debug port test. The tool for debug port test is shown below. Figure 2-1 A set of tool for debug port test 1. Not a Serial Port model should connect a debug port test cable to connector CN3110 of a system board.
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Troubleshooting Procedures Table 2-4 Debug port error status (1/2) pending System BIOS Boot block processing Debug Code BIOS processing outline Target Device IC No. CPU setup IS1050 (CPU Socket) Initialization of IC3400 (Super I/O) Super I/O PCH ,Super I/O F000 Boot Block processing start BIOSROM IC3000 (BIOS ROM)
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Troubleshooting Procedures Table 2-4 Debug port error status (2/2) System BIOS IRT processing Debug Code BIOS processing outline Target Device IC No. F100 IRT section start IS1050 (CPU Socket) IC3000/IC3002 (BIOS ROM) Creation of SETUP BIOSROM F101 CN1400, CN1410 (RAM information Conn.) F102...
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Troubleshooting Procedures S3 shift start CN1400, CN1410 (RAM F116 Conn.) CN1400, CN1410 (RAM F117 S4 shift start Conn.) CN1400, CN1410 (RAM F118 S5 shift start Conn.) USB electric supply setting IC1600 (PCH) F119 start IC3200 (EC/KBC) Completion of a USB IC1600 (PCH) F11A electric supply setting...
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Troubleshooting Procedures 2.4.3 Procedure 3 Diagnostic Test Program Execution Check Execute the following tests from the Diagnostic Test Menu. These tests check the system board. Refer to Chapter 3, Tests and Diagnostic, for more information on how to perform these tests. 1.
Troubleshooting Procedures USB FDD Troubleshooting To check if the USB FDD is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: FDD Head Cleaning Check Procedure 2: Diagnostic Test Program Execution Check Procedure 3: Connector Check and Replacement Check 2.5.1 Procedure 1 FDD Head Cleaning Check FDD head cleaning is one option available in the Diagnostic Program.
Troubleshooting Procedures 2.5.2 Procedure 2 Diagnostic Test Program Execution Check Insert the Diagnostics Disk in the USB FDD, turn on the computer and run the test. Refer to Chapter 3, Tests and Diagnostics, for more information about the diagnostics test procedures. Make sure the floppy disk is formatted correctly and that the write protect tab is disabled.
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Troubleshooting Procedures 2.5.3 Procedure 3 Connector Check and Replacement Check USB FDD is connected to USB port on system board or USB/Sound board. The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks.
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Troubleshooting Procedures NOTE: When checking the connection, be sure to check it with care for the followings. 1. Cable can not be disconnected from the connector. 2. Cable is connected straight to the connector. 3. Cable is connected all the way seated in the connector. 4.
User’s Manual. 2.6.1 Procedure 1 Partition Check Insert the Toshiba DOS system disk and start the computer. Perform the following checks: Check 1 Input C: and press Enter. If you cannot change to drive C, go to Check 2. If you can change to drive C, go to Procedure 2.
Troubleshooting Procedures 2.6.2 Procedure 2 Message Check When the power is turned on, the system performs the Initial Reliability Test (IRT) installed in the BIOS ROM. When the test detects an error, an error message is displayed on the screen. Make sure no floppy disk is in the FDD.
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Troubleshooting Procedures 2.6.3 Procedure 3 Format Check The computer’s HDD is formatted using the DOS FORMAT program or the physical format program of the test program. To format the HDD, start with Check 1 below and perform the other steps as required. Refer to the DOS Manual for the operation of DOS.
Troubleshooting Procedures 2.6.4 Procedure 4 Diagnostic Test Program Execution Check The HDD test program is stored in the Diagnostics Disk. Perform all of the HDD tests in the Hard Disk Drive Test. Refer to Chapter 3, Tests and Diagnostics, for more information about the HDD test program.
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Troubleshooting Procedures 2.6.5 Procedure 5 Connector Check and Replacement Check The SATA HDD may be disconnected, or the SATA HDD or system board may be damaged. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures and perform the following checks: Check 1 Make sure the SATA HDD is firmly connected to CN1900 on the system board.
Troubleshooting Procedures Keyboard Troubleshooting To check if the computer’s keyboard is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.7.1 Procedure 1 Diagnostic Test Program Execution Check Execute the Keyboard Test (DIAGNOSTIC TEST) and Pressed key display test (ONLY ONE TEST) in the Diagnostic Program.
Troubleshooting Procedures Touch pad or Dual point Troubleshooting To check if the computer’s touch pad is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.8.1 Procedure 1 Diagnostic Test Program Execution Check Execute the Touch pad test (ONLY ONE TEST) in the Diagnostic Program.
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Troubleshooting Procedures 2.8.2 Procedure 2 Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the button board and system board.
Troubleshooting Procedures Display Troubleshooting This section describes how to determine if the computer’s display is functioning properly. Start with Procedure 1 and continue with the other procedures as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Cable Check Procedure 3: Replacement Check Procedure 1 Diagnostic Test Program Execution Check...
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Troubleshooting Procedures Procedure 3 Replacement Check The LCD module and system board are connected to display circuits. Any of these components may be damaged. Refer to Chapter 4, Replacement Procedures. Check 1 Replace the LCD cable with a new one following the instructions in Chapter 4, Replacement Procedures and test the display again.
Troubleshooting Procedures 2.10 Optical Disk Drive Troubleshooting To check if optical disk drive is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.10.1 Procedure 1 Diagnostic Test Program Execution Check Execute the CD-ROM/DVD-ROM Test in the Diagnostic Program.
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Troubleshooting Procedures Check 2 The SATA ODD may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures. If the problem still exists, perform Check 3. Check 3 System board may be faulty. Replace it with new one following the instructions in Chapter 4, Replacement Procedure.
Troubleshooting Procedures 2.11 Modem Troubleshooting To check if modem is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.11.1 Procedure 1 Diagnostic Test Program Execution Check Execute Modem test in the LAN/Modem/Bluetooth/IEEE1394 test program.
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Troubleshooting Procedures Check 2 Modem cable may be faulty. Replace it with a new one. If the problem still occurs, perform Check 3. Check 3 MDC may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedure.
Troubleshooting Procedures 2.12 LAN Troubleshooting To check if the computer’s LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check and Replacement Check 2.12.1 Procedure 1 Diagnostic Test Program Execution Check Execute LAN test in the LAN/Modem/Bluettoth/IEEE1394 test program.
Troubleshooting Procedures 2.13 Wireless LAN Troubleshooting To check if the computer’s Wireless LAN is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Transmitting-Receiving Check Procedure 2: Antennas’ Connection Check Procedure 3: Replacement Check 2.13.1 Procedure 1 Transmitting-Receiving Check Before starting the test, make sure the wireless communication switch is set in the ON position.
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Troubleshooting Procedures 2.13.2 Procedure 2 Antennas' Connection Check The wireless LAN function-wiring diagram is shown below: Any of the connections may be defective. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the wireless communication switch is “On”.
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Troubleshooting Procedures 2.13.3 Procedure 3 Replacement Check Wireless LAN card, wireless LAN antenna or system board may be faulty. Refer to Chapter 4, Replacement Procedures, for instructions on how to disassemble the computer and then perform the following checks: Check 1 Wireless LAN antenna may be faulty.
Troubleshooting Procedures 2.14 Bluetooth Troubleshooting To check if the Bluetooth is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connection Check and Replacement Check Procedure 1 Diagnostic Test Program Execution Check Make sure the wireless switch on the left side of the computer is turned “On”.
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Troubleshooting Procedures Check 2 The Bluetooth module may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures and check the operation. If the problem still exists, perform Check 3. Check 3 The Bluetooth cable may be damaged. Replace it with a new one following the instructions in Chapter 4, Replacement Procedures.
Troubleshooting Procedures 2.15 Sound Troubleshooting To check if the sound function is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Diagnostic Test Program Execution Check Procedure 2: Connector Check Procedure 3: Replacement Check 2.15.1 Procedure 1 Diagnostic Test Program Execution Check Execute the Sound test in Sound Test program disk.
Troubleshooting Procedures 2.15.3 Procedure 3 Replacement Check If headphone does not work properly, perform check 1. If external microphone does not work properly, perform check 2. If internal microphone does not work properly, perform check 3. If Speaker Right does not work properly, perform check 4. ...
Troubleshooting Procedures 2.16 Bridge media Slot Troubleshooting This section describes how to determine if the computer's Bridge media functions are functioning properly. Perform the steps below starting with Procedure 1 and continuing with the other procedures as required. Procedure 1: Check on Windows OS Procedure 2: Connector Check and Replacement Check 2.16.1 Procedure 1 Check on Windows OS Insert a Bridge media (SD memory card/SDIO card/Memory stick/Memory stick Pro/...
Troubleshooting Procedures 2.17 PCI ExpressCard Slot Troubleshooting This section describes how to check PCI ExpressCard slot by inspecting a card with PCI Express interface and a card with USB 2.0 interface. 1. Gigabit Ether ExpressCard 2. USB2.0 5in1 ExpressCard 1. Gigabit Ether ExpressCard (1) Insert the Gigabit Ether ExpressCard into the ExpressCard slot.
Troubleshooting Procedures 2.18 Fingerprint sensor Troubleshooting CAUTION: To delete the account for confirming the fingerprint operation, it is necessary to log on by the account with the management authority. If the password has been set to log on, ask the Log-ON password to the user. To check if the Fingerprint sensor works correctly or not, follow the troubleshooting procedures below as instructed.
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Troubleshooting Procedures Procedure 1 Setting Windows Log-ON password 1. Open [User Account] from [Control Panel]. 2. Click [User Account]. 3. Click the icon of the account (user’s name) that you want to set the password. 4. Click “Create Account”. 5. Type a password in “Type a new password”. 6.
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Troubleshooting Procedures 7. When the Store to Sensor screen is displayed, check Store fingerprint to Sensor. Click Finish to complete fingerprint registration. Procedure 3 Authentication of fingerprint 1. Turn on the computer to start up Windows. 2. In the Windows logon window, put lightly the first joint of your finger registered and slide your finger sideways.
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Troubleshooting Procedures Procedure 4 Connector Check and Replacement Check The connection of the cable and board may be defective. Otherwise, they may be faulty. Disassemble the computer following the steps described in Chapter 4, Replacement Procedures, and perform the following checks: Check 1 Make sure the cables are firmly connected to the Finger/pad board and system board.
Troubleshooting Procedures 2.19 Web camera Troubleshooting To check if the computer’s web camera is malfunctioning or not, follow the troubleshooting procedures below as instructed. Procedure 1: Check on Windows OS Procedure 2: Connector Check and Replacement Check 2.19.1 Procedure 1 Check on Windows OS Use the software, Camera Assistant Software, which is originally prepared in the computer to check if the web camera can record/replay still images and moving images (including sound) without problems.
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Troubleshooting Procedures Check 2 If web camera does not work properly(the image from a web camera cannot be displayed. ), web camera may be faulty. Replace it with a new one following the steps in Chapter 4, Replacement Procedures. If the problem still occurs, perform Check 3 Check 3 System board may be faulty.
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Troubleshooting Procedures 2-64 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Tests and Diagnostics Chapter 3 Tests and Diagnostics TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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Tests and Diagnostics [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics Chapter 3 Contents The Diagnostic Test ....................3-7 3.1.1 Diagnostics menu ................. 3-7 3.1.2 H/W (Hardware) initial information setting tool........3-8 3.1.3 Heatrun test program................3-9 Executing the Diagnostic Test ................. 3-10 3.2.1 Diagnostics menu (T&D) ..............3-11 3.2.2 H/W initial information setting tool ...........
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Maintenance (WinPE&FreeDos) Test Program Operation ........3-95 3.32.1 . Outline....................3-95 3.32.2 Outline of Specification ..............3-95 3.33 . Starting TOSHIBA Test & Diagnostic ..............3-96 3.33.1 Starting from CD ................3-96 3.34 . Windows PE T&D ....................3-98 3.34.1 Equipment Configuration for Test .............
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Tests and Diagnostics 3.34.2 Starting T&D..................3-99 3.34.3 System Information Menu..............3-100 3.34.4 Test Menu..................3-104 3.34.5 System Utility Menu ................ 3-111 3.34.6 Details of Each Test Function ............3-117 3.35 DOS T&D ......................3-144 3.35.1 Configuration of Test Equipment............. 3-144 3.35.2 How to start T&D................
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Tests and Diagnostics Tables Table 3-1 Subtest names (1/2) .................... 3-18 Table 3-2 Error codes and error status names (1/3)............3-41 Table 3-3 Hard disk controller status register contents ............3-44 Table 3-4 HDC Error register contents................3-45 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Tests and Diagnostics The Diagnostic Test This chapter explains how to use the Diagnostic Test programs to test the functions of the computer’s hardware modules. The Diagnostics Programs are stored on some Diagnostic Disks. There are Service Program Modules (DIAGNOSTIC MENU) and the Test Program Modules (DIAGNOSTIC TEST MENU) on the Diagnostic Disk.
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A cleaning kit to clean the floppy disk drive heads (Head Cleaning) An external display supporting monitor ID (Expansion test) A CD test media TOSHIBA CD-ROM TEST DISK or ABEX TEST CD-ROM (Sound test) A DVD test media (DVD-ROM TEST DISK TSD-1) (Sound test) ...
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Tests and Diagnostics The Diagnostics Disk (Main T&D) 3.1.3 Heatrun test program The heatrun test starts automatically after the selection. You will need the following equipment to perform this program. The Diagnostics Disk (Main T&D) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
Tests and Diagnostics Executing the Diagnostic Test To start the Repair test program, follow these steps: 1. Insert the Repair test program disk in the USB floppy disk drive or Optical disk drive. 2. Turn on the computer while pressing U key. The following menu appears. The following menu is an example when Repair test program is performed from NOTE: the floppy disk.
Set the highlight bar to 3, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTICS MENU : 1 - DIAGNOSTIC TEST 2 – ONLY ONE TEST...
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Set the highlight bar to 1, and press Enter. The following DIAGNOSTIC TEST MENU will appear: TOSHIBA personal computer XXXXXX DIAGNOSTICS version X.XX (c) copyright TOSHIBA Corp. 20XX DIAGNOSTIC TEST MENU : 1 - SYSTEM TEST 2 - MEMORY TEST...
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Tests and Diagnostics Select the option you want to execute and press Enter. When you select 1- SYSTEM TEST, the following message will appear: SYSTEM TEST NAME XXXXXX xxxxxxx DIAGNOSTIC TEST VX.XX [Ctrl]+[Break] : test end [Ctrl]+[C] : key stop SUB-TEST : XX PASS COUNT : XXXXX...
Tests and Diagnostics Use the up and down arrow keys to move the cursor to “ERROR STOP”. Use the right and left arrow keys to move the cursor to the desired option and press Enter. Selecting YES of ERROR STOP stops the test program when an error is found and displays the operation guide on the right side of the display screen as shown below: ERROR STATUS NAME [[ HALT OPERATION ]]...
Tests and Diagnostics Setting of the hardware configuration To execute this program, input 1 in the startup menu. Then press Enter to select the (2)- . The H/W initial information setting tool consists of four subtests. Initial config set Input the number you want to execute and press Enter. NOTE: Connect USB FDD, when you perform the Repair test program from the CD- ROM.
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Tests and Diagnostics 7. “Create DMIINFO TXT (Y/N)?” is displayed. Press Y, then the DMI information (text data) is written to the Floppy disk, etc. Setting of the HWSC Setting of the UUID Display of the DMI information (including UUID) After completion of the above settings, H/W configuration &...
Tests and Diagnostics Heatrun Test To execute this program, press 2, Repair Heatrun and press Enter in the startup menu, press Enter. After selecting this test, the same subtests as 3.23 RUNNING TEST is executed successively. For more details on the procedure and test content, refer to RUNNING TEST. When the heatrun test ends, following message appears in the display.
Tests and Diagnostics Subtest Names Table 3-1 lists the subtest names for each test program in the DIAGNOSTIC TEST MENU. Table 3-1 Subtest names (1/2) Test Name Subtest No. Subtest Name SYSTEM ROM checksum Fan ON/OFF Geyserville Quick charge DMI read Conventional memory MEMORY Protected Mode...
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Tests and Diagnostics Table 3-1 Subtest names (2/2) Test Name Subtest No. Subtest Name PRINTER Ripple pattern [Not supported] Function Wraparound FIR/SIR Point to point (send) ASYNC [Not supported] FIR/SIR Point to point (receive) Wraparound (board) HARD DISK Sequential read Address uniqueness Random address/data Cross talk &...
Tests and Diagnostics System Test To execute the System Test select 1 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 ROM checksum This subtest executes a checksum test of the BIOS ROM (range: F0000h to...
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Tests and Diagnostics If the CPU supports Gerserville (SpeedStep), this Subtest checks that the CPU operating clock speed can be changed. If the CPU does not support Gerserville (SpeedStep), the following message is displayed and the test is ended. This chip is not supported Subtest 04 Quick Charge This subtest checks the status for the quick charge.
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Tests and Diagnostics To test the cache memory, a pass-through write-read comparison of ‘5Ah’ data is run repeatedly to the test area (‘7000’: ‘Program’ size to ‘7000’: ‘7FFF’ (32 KB)) to check the hit-miss ratio (on/off status) for CPU cache memory.
Tests and Diagnostics Keyboard Test To execute the Keyboard Test, select 3 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Pressed key code display When a key is pressed, the scan code, character code, and key top name are...
Tests and Diagnostics Display Test To execute the Display Test, select 4 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 VRAM read/write for VGA This subtest writes the constant data (AAAAh and 5555h) to the video RAM.
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Tests and Diagnostics Subtest 04 Gradation & Mode test for VGA This subtest displays gradations for following modes. To change the mode, press Enter. [Mode 12] [Mode 13] [Mode 3] [Mode 111 640*480 64K] [Mode 112 640*480 16M] [Mode 114 800*600 64K] [Mode 115 800*600 16M]...
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Tests and Diagnostics Subtest 06 “H” Pattern Display This subtest displays a full screen of “H” patterns. HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH HHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHHH To exit this subtest and return to the DISPLAY TEST menu, press Enter. NOTE: The last row may not be completely filled.
Tests and Diagnostics Floppy Disk Test CAUTION: Before running the floppy disk test, prepare a formatted work disk. Remove the Diagnostics Disk and insert the work disk into the FDD. The contents of the floppy disk will be erased. To execute the Floppy Disk Test, select 5 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
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Tests and Diagnostics Select the number of the subtest you want to execute and press Enter. The following message will appear during the floppy disk test. xxx DIAGNOSTIC TEST VX.XX FLOPPY DISK IN PROGRESS XXXXXXX [Ctrl]+[Break] : test end [Ctrl]+[C] key stop SUB-TEST : XX...
Tests and Diagnostics 3.10 Printer Test CAUTION: Printer Test is not supported for this model. To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. NOTE: An IBM compatible printer must be connected to the system to execute this test. Also, printer port wraparound connector must be connected.
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Tests and Diagnostics Subtest 02 Function This subtest is for IBM compatible printers, and tests the following functions: Normal print Double-width print Compressed print Emphasized print Double-strike print All characters print This subtest prints the various print types shown below: Subtest 03 Wraparound NOTE: To execute this subtest, a printer wraparound connector must be connected to the...
Tests and Diagnostics 3.11 Async Test To execute the Printer Test, select 6 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. To execute the Async Test, select 7 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions displayed on the screen.
Tests and Diagnostics 3.12 Hard Disk Test To execute the Hard Disk Test, select 8 from the DIAGNOSTIC TEST MENU, press Enter, and follow the directions on the screen. CAUTION: The contents of the hard disk will be erased when subtest 02, 03, 04, 06, 08 or 09 is executed.
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Tests and Diagnostics 4. The Hard Disk Test message will appear after you respond to the Detail Status prompt. Select the number of the subtest you want to execute and press Enter. The following message will appear during each subtest. XXX DIAGNOSTIC TEST VX.XX HARD DISK TEST XXXXXXX [Ctrl]+[Break] :...
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Tests and Diagnostics Subtest 04 Cross talk & peak shift This subtest writes eight types of worst pattern data (listed below) to a cylinder, then reads the data while moving from cylinder to cylinder. (Test the data interference in the neighbor track) Worst pattern data Cylinder ‘B5ADAD’...
Tests and Diagnostics 3.14 Real Timer Test To execute the Real Timer Test, select 9 from the DIAGNOSTIC TEST MENU, press Enter and follow the directions on the screen. Move the highlight bar to the subtest you want to execute and press Enter. Subtest 01 Real time A new date and time can be input during this subtest.
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Tests and Diagnostics Subtest 03 Real time carry CAUTION: When this subtest is executed, the current date and time are erased. This subtest checks the real time clock increments, making sure the date and time are displayed in the following format: Current date : 12-31-1999 Current time : 23:59:58 The real time increments are automatically executed and the following is...
Tests and Diagnostics 3.15 NDP Test To execute the NDP test, select 10 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. CAUTION: Judge the existence of high-speed operation processor by 1bit of the composition byte. If exists, the bit is “1”. Test only when the high-speed operation processor exists.
Tests and Diagnostics 3.16 Expansion Test To execute the expansion test, select 11 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. Subtest 01 PCMCIA wraparound [It is not supported] CAUTION: PCMCIA wraparound test is not supported for this model. NOTE: To execute this subtest, the PC card wraparound connector is required.
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Tests and Diagnostics Subtest 02 RGB monitor ID NOTE: To execute this subtest, monitor supporting EDID (Extended Display Identification Data) is required. Connect a wraparound connector to CRT monitor for the test of ID acquisition. This subtest is executed by using VESA command. CAUTION: It becomes NG because the priority is given to the internal monitor in a simultaneous display mode.
To execute the CD-ROM/DVD-ROM test, select 12 from the DIAGNOSTICS TEST MENU, press Enter and follow the directions on the screen. NOTE: For the subtest 01, 02 and 03, use the TOSHIBA CD-ROM TEST DISK TDY-01 or ABEX TEST CD-ROM TCDR-702 and DVD-ROM TEST DISK TSD-1. For the subtest 04, use a CD-RW on the market.
Tests and Diagnostics 3.18 Error Code and Error Status Names Table 3-2 lists the error codes and error status names for the Diagnostic Test. Table 3-2 Error codes and error status names (1/3) Device name Error code Error status name (Common) Data Compare Error ROM - CHECKSUM ERROR...
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Tests and Diagnostics Table 3-2 Error codes and error status names (2/3) Device name Error code Error status name FDD - BAD COMMAND ERROR FDD - ADDRESS MARK NOT FOUND FDD - WRITE PROTECTED FDD - RECORD NOT FOUND FDD - DMA OVERRUN ERROR FDD - DMA BOUNDARY ERROR FDD - CRC ERROR FDD - FDC ERROR...
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Tests and Diagnostics Table 3-2 Error codes and error status names (3/3) Device name Error code Error status name (HDD) HDD - WRITE FAULT HDD - STATUS ERROR HDD - BAD SECTOR HDD - ACCESS TIME ERROR HDD - NO HDD HDD - DMA CRC ERROR NDP - NO CO-PROCESSOR NDP - CONTROL WORD ERROR...
Tests and Diagnostics 3.19 Hard Disk Test Detail Status When an error occurs in the hard disk test, the following message is displayed: HDC status = XXXXXXXX Detailed information about the hard disk test error is displayed on the screen by an eight- digit number.
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Tests and Diagnostics Table 3-4 HDC Error register contents Name Description “0” … Not used (Bad block mark) “1” … A bad block mark is detected. “0” … There is no uncorrectable data error. (Uncorrectable) “1” … Uncorrectable data error has been detected. ——...
Tests and Diagnostics 3.20 ONLY ONE TEST 3.20.1 Program Description This program tests the unique functions of this model. 3.20.2 Operations Select test 2 from the DIAGNOSTIC MENU and press Enter. The following menu appears in the display. ################################################################ ######## ONLY ONE TEST Menu (QOSMIO G20) ######## ################################################################...
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Tests and Diagnostics Subtest 01 Pressed Key Display (Main key) When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink.
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Tests and Diagnostics Subtest 02 Pressed Key Display (Ten key): Not used When you execute this subtest, the keyboard layout is drawn on the display as shown below. When any key is pressed, the corresponding key on the screen changes to the key character that was pressed. Holding a key down enables the auto-repeat function that causes the key’s display character to blink.
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Tests and Diagnostics Subtest 03 Touch Pad This subtest checks the functions of the touch pad as shown below. A) Direction and parameter B) Switching function check. This test displays the response from the touch pad and touch pad switch. When moving your finger on the touch pad towards the upper left, the <POINTING>...
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Tests and Diagnostics Subtest 04 Wireless communication Switch This subtest checks if the Wireless communication switch works properly. If the test is started with the switch ON, following message appears in the display. Wireless communication Switch is set to a start position (OFF) Slide the switch to OFF position.
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Tests and Diagnostics NG message appears in the display if a defective is found during the test. Confirm the connection of cable, then execute the test again. Press 9 and return to ONLY ONE TESST menu. Subtest 06 This subtest checks if each LED lights properly. The following message appears in the display in order.
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Tests and Diagnostics Subtest 07 Button This subtest checks the moving of the of the front operation panel button. Press the eco button after the following message appears. Step 1 Press Function button (Assist button ) OK message appears in the display if the test ends without an error. Press any key return to each Steps if NG! or Press any key message apprears.
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Tests and Diagnostics Subtest 08 Acceleration sensor This subtest detects and corrects the each axis (X, Y, Z). NOTE: Make sure that this subtest is executed on the following condition: 1. Flat desk with vertical plane to get the stability of machine. 2.
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Tests and Diagnostics When this subtest is selected, the following message appears in the display. The heaven surface establishes in the upper direction Press [Enter] key NOTE: Be sure to execute the test with the display panel opened. Set the machine on the flat desk. Then press Enter to detect the data on this setting of machine.
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Tests and Diagnostics Subtest 09 Docker Dock/Undock This subtest is executed with an Slim Port Replicator II. installed. Press Enter while pushing the eject button of the Slim Port Replicator II. the following message appears. Pushing Eject-SW, and press [Enter] Key Press Enter without pushing the eject button of the Slim Port Replicator II.
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Tests and Diagnostics Subtest 0B Volume This subtest checks if control dial works properly. Volume Step1 The following message appears in the display. Volume button test Press Volume [ Down(-) ] Please press volume down button. Step2 The following message appears in the display. Volume button test Press Volume [ Up(+) ]...
Tests and Diagnostics 3.21 Head Cleaning 3.21.1 Function Description This function cleans the heads in the FDD by executing a series of head load/seek and read operations. A cleaning kit is necessary to perform this program. 3.21.2 Operations 1. Selecting test 4 from the DIAGNOSTIC MENU and pressing Enter displays the following messages: DIAGNOSTICS - FLOPPY DISK HEAD CLEANING : VX.XX Mount cleaning disk(s) on drive(s).
Tests and Diagnostics 3.22 Log Utilities 3.22.1 Function Description This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or output the data to a printer. Connect USB FDD, when you perform the DIAGNOSTIC PROGRAM from the NOTE: DVD-ROM.
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Tests and Diagnostics 3.22.2 Operations Select 5 and press Enter in the DIAGNOSTIC MENU, logs error information into RAM or onto a floppy disk. The error information is displayed in the following format: XXXXX ERRORS TS-NO PASS STS ADDR WD RD HSTS [ERROR STATUS NAME] FDD 02 0000 103 00001 00 00 0000 FDD-WRITE PROTECTED...
Tests and Diagnostics 3.23 Running Test 3.23.1 Function Description This function automatically executes the following tests in sequence: 1. System test (subtest 01) 2. Memory test (subtests 01, 02) 3. Display test (subtest 01) 4. Real timer test (subtest 02) 5.
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Tests and Diagnostics TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-61...
1. FORMAT NOTE: This program is only for testing a floppy disk drive. The option is different from the Toshiba MS-DOS FORMAT command. This program can format a floppy disk in the following formats: (a) 2DD: Double-sided, double-density, double-track, 96/135 TPI, MFM mode, 512 bytes, 9 sectors/track.
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Tests and Diagnostics 3.24.2 Operations 1. Selecting 7 from the DIAGNOSTIC MENU and pressing Enter displays the following message: [ FDD UTILITIES ] 1 - FORMAT 2 - COPY 3 - DUMP 4 – HDD-ID READ 9 - EXIT TO DIAGNOSTICS MENU 2.
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Tests and Diagnostics 3. COPY program (a) When COPY is selected, the following message appears: FLOPPY DISK FORMAT & COPY : VX.XX Type select (0:2DD,3:2HD) ? (b) Selecting a media/drive type number will display a message similar to the one below: Insert source disk into drive A: Press any key when ready.
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Tests and Diagnostics 4. DUMP program (a) When DUMP is selected, the following message appears: DIAGNOSTICS-HARD DISK & FLOPPY DISK DUMP : VX.XX Drive type select (1:FDD, 2:HDD) ? (b) Select a drive type. If is selected, the display will go to step (h). If 2:HDD is selected, the following message will appear: 1:FDD...
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Tests and Diagnostics (k) The following message will appear. To finish the dump, select 3. Press number key (1:up,2:down,3:end) ? (l) The following message will appear. Selecting 2 returns to the FDD UTILITIES MENU. Another dump (1:Yes,2:No) ? HDD ID READ program Selecting HDD ID displays the following HDD ID configuration: [HDD ID Read (VX.XX)] [Drive #1] [Drive #2]...
Tests and Diagnostics 3.25 System Configuration 3.25.1 Function Description The System Configuration program contains the following configuration information for the computer: 1. Processor Type [Code/L2 cache] 2. Chip set [VRAM] 3. BIOS ROM version [1st ID, 2nd ID] 4. Boot ROM version 5.
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Tests and Diagnostics 3.25.2 Operations Select 8 from the DIAGNOSTIC MENU and press Enter. Then, the following system configuration appears in the display. System Configuration Display: Ver X.XX [Machine Name???] - Processor Type = XXXXXX-XXXXXMHz Code = XX L2 Cache = XXXXXKB - Chip set = XXXXXX VGA Chip =...
1. Slide the wireless communication switch to “ON” position. 2. Check the card type according to the following procedure: Click [Start] -> [All Programs] -> [TOSHIBA] -> [Utilities] -> [PC Diagnostic Tool]. Check the “Network”. If the “ ” , “...
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Tests and Diagnostics Check of the antenna connection 1. Confirm that the icon for wireless LAN appears at the lower right of the screen under the circumstances the wireless LAN communication is available. (It is no problem if a cross is shown on the icon.) 2.
Tests and Diagnostics 3.27 Wireless LAN Test Program (Intel-made a/b/g/n Setting up of REF PC) For the test of Intel-made wireless LAN cards, configure the test environment as shown below with the following equipment. ・ AP (which can operate on Windows XP and is corresponding to access point 11a, 11b and 11g)...
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Tests and Diagnostics Open “My Computer” window and click “My Network places” on the left column. Click “View network connections” on the left column. The “Network Connections” window appears. Double-click “Local Area Connection”. Network Connections window 3-72 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics Click “Install…” button on the “Local Area Connection Properties” window. Local Area Connection Properties window Select “Protocol” on the “Select Network Component Type” window and click “Add…” button. Select Network Component Type window Click “Have Disk…” button on the “Select Network Protocol” window. Select Network Protocol window TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-73...
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Tests and Diagnostics When “Install From Disk” window appears, click “Browse…” and specify the created “Clx_Res” folder. Then Click “OK”. (For the test, “PACKET.INF” file is used.) Install From Disk window The “Select Network Protocol” window appears again. In the “Network Protocol”, “DDK PACKET Protocol”...
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Tests and Diagnostics After the completion of REF PC setup, restart the WINDOWS. Then perform the Responder test program for Windows (WTWINSVR.EXE) in the Clx_Res folder. ・WTWINSVR.EXE Function : Transmitting/receiving of data to/from DUT via AP OS available : Windows XP only How to start : Double-click WTWINSVR icon.
Tests and Diagnostics 3.28 Wireless LAN Test Program on DUT PC (Intel-made) 3.28.1 Wireless LAN Test Program (Intel-made : Shirley Peak) on DUT PC This section describes how to perform the wireless LAN transmitting-receiving test (Intel- made 802.11 a/b/g). To execute the wireless LAN test, use the Diagnostics disk for wireless LAN test.
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Tests and Diagnostics To execute the subtest, input the subtest number and press Enter. Subtest01 Communication test of 11a mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11a mode using the main antenna. If a defective is not found during the test, OK message will appear in the display.
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Tests and Diagnostics Subtest03 Communication test of 11g mode for 5100/5150 module (Two antenna type) This subtest execute transmitting/receiving test in 802.11g mode using the main antenna. If a defective is not found during the test, OK message will appear in the display.
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Tests and Diagnostics Subtest06 Communication test of 11b mode for 5100/5150 module (Three antenna type) This subtest execute transmitting/receiving test in 802.11b mode using the main antenna. If a defective is not found during the test, OK message will appear in the display.
Tests and Diagnostics 3.29 LAN/Modem/Bluetooth/IEEE1394 Test Program This section describes how to perform the LAN/Modem/Bluetooth/IEEE1394 test with the test program. Insert the test program disk for LAN/Modem/Bluetooth/IEEE1394 test in FDD and turn on the power. The following message will appear: Microsoft Windows XX Startup Menu ---------------------------------- Modem...
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Tests and Diagnostics Subtest01 (i82562 + ICHx) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. The following message will appear: [LAN transmit & receive test !] COMPLETED Repeat count = 00000 Error count 00000 LOOPBACK TEST 100Mbps Auto-negotiation TxRx Test...
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Tests and Diagnostics Subtest02 (GbE) This subtest checks the operation of mini-PCI I/F by the loopback test in the chip. Select 2 to execute and press Enter. The following message will appear: Testing adaptor...hit <ESC> to abort. External Loopback Test...PASSED Testing completed.
Tests and Diagnostics 3.29.2 Modem test For this subtest, connect the modem PCB and RJ11 connector with a harness. Use the dedicated “FAT-MODE inspection device (product code: QE2000P01 made by Nitto Denki Seisakusyo)” for the tests. ################################################################## ###### AC97' Modem Controller Diagnostics program ####### ################################################################## 1 ....
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(A mobile phone with the Bluetooth function is also available.) ・ A Bluetooth card should be installed on the target computer. Install the Bluetooth function by clicking [All Programs] -> [TOSHIBA] -> [Bluetooth] -> [Bluetooth Settings]. Test procedure 1.
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Tests and Diagnostics 5. Select “Diagnostics” tab and click “Run”. 6. Check the “Log” to confirm the test result. BT address of test computer BT address of responder device 7. When the BT (Bluetooth) address of the responder device appears, the Bluetooth card and antenna connection are OK.
Tests and Diagnostics 3.29.4 IEEE1394 test (Not Used) To execute this test, input 4 and press Enter. NOTE: Use another computer that can communicate by IEEE1394 (i. Link) cable as a reference machine to perform this test. The following menu will appear: ******************************************************************** ******** IEEE1394[XXXXX] Diagnostics program...
Therefore, please test the sound on Windows OS. 1) Play a music file. 2) click TOSHIBA-> utility -> "PC diagnostic tool." to test the sound Please check operation of speakers by one of methods. TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
Tests and Diagnostics 3.31 SETUP 3.31.1 Function Description This program displays the current system setup information as listed below: Main menu System Time(System time ) System Date(System date ) CPU Type CPU Speed HDD1/SSD1 Total Memory Size System BIOS Version EC Version AMT Setup Prompt Language...
Tests and Diagnostics Power Management menu Wake-up on LAN Wake-up on LAN on Battery Wake on Keyboard Critical Battery Wake-up Dynamic CPU Frequency Mode Core Multi-Processing Intel Turbo boosts eSATA SATA Interface setting BIOS Power Management Advanced menu Execute-Disable Bit Capability Virtualization Technology Trusted Execution Technology Beep Sound...
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Tests and Diagnostics 3.31.2 Accessing the SETUP Program Turn on the power SW. then press F2. The following display appears. Main menu screen 3-90 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics Security menu screen Power Management menu screen TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-91...
Tests and Diagnostics Advanced menu screen Exit menu screen 3-92 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics Moving Within the SETUP Menu and Changing Values 1. Press and to move between the two columns. Press and to move between items in a column. 2. Press either the [Enter]Key to change the value. Accepting Changes and Exiting the SETUP Window 1.
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Tests and Diagnostics How to change setup Options Since a help is displayed on the right-hand side of each menu screen, it is referred to. 3-94 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Tests and Diagnostics 3.32 Maintenance (WinPE&FreeDos) Test Program Operation 3.32.1 . Outline This document explains how to operate T&D that is released through TOSHIBA Test & Diagnostic CD. 3.32.2 Outline of Specification The TOSHIBA Test & Diagnostic CD already released includes WindowsPE T&D (hereafter, referred as WinPE T&D) and Freedos T&D (hereafter, referred as Fdos T&D) and...
3.33 . Starting TOSHIBA Test & Diagnostic 3.33.1 Starting from CD 1. Load the TOSHIBA Test & Diagnostic Discs into the optical disc drive and turn off the computer's power. 2. While holding down F12 key on the keyboard, turn on your computer - when the logo screen appears, release the F12 key.
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Tests and Diagnostics NOTE: After [winpe] is selected, the following message is displayed on the screen. At this time, ”Press any key to boot from CD or DVD..” is displayed, but only [ENTER] key is valid. ress the Enter key again on this screen. If the Enter key is pressed, WindowsPE will start. The key different from an Enter key is pressed.
Tests and Diagnostics 3.34 . Windows PE T&D 3.34.1 Equipment Configuration for Test The following table indicates equipment configuration necessary for conduction of the tests items shown below using WinPE T&D. Test Item Equipment required Remarks USB flash memory Free space : More than 12MB (When you start WinPE T&D from a USB memory, use 512MB or more of USB memory.) Media containing test data...
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After the startup of the OS, unless CD volume name is WINTDCD or USB volume name is WINTDUSB, WinPE T&D does not start automatically. Note: If the system starts up from the TOSHIBA Test & Diagnostic CD, WinPE T&D in the USB memory starts when the USB memory created in section 3-5-2 is connected.
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Tests and Diagnostics 3.34.3 System Information Menu If you set the TOSHIBA Test & Diagnostic CD to the ODD drive and run WinPE T&D, the following test selection screen is displayed. (For further details, refer to Chapter 2.) Hereinafter, System Information will be described in detail.
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Tests and Diagnostics 3.34.3.2 Details of the system information displayed on an information tree The details of the system information item displayed on each information tree are shown below. ● BIOS The following items display DMI and BIOS information of the PC. Item Description Manufacturer...
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Tests and Diagnostics ● MEMORY The following item displays memory information of the PC. Item Description Physical Memory Displays the capacity (GB) of the physical memory on the PC ● NETWORK The following items displays network card information of the PC. If more than one network card is connected, the information of up to 4 network cards are displayed.
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Tests and Diagnostics ● ODD The following item displays ODD information of the PC. If more than one ODD is connected, the information of up to 4 ODDs are displayed. Item Description ODD0 - 3 Displays the name and the media type of the ODD connected to the PC.
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Tests and Diagnostics 3.34.4 Test Menu This section explains the Diagnostics screen. 3.34.4.1 Explanation of each item ▼ [Multitask] check box Checking this box activates each test as multi-task. ▼ [CPU Stress] check box Checking this box applies any stress to the CPU during the test. Restriction: If the test is conducted, uncheck Multitask in the Simple mode before the test because of too much stress to be applied to the CPU.
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Tests and Diagnostics ▼ Testing time Updates the testing time and displays it in real time during the execution of the test. ▼ Test setting and Result This will be explained in section 3-4-2. 3.34.4.2 Test setting and Result ▼ TEST Item Checks the check box of the item to be tested. ▼...
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Tests and Diagnostics Status Description Device not connected Peripheral device necessary for the test is not connected. USB flash memory, FDD and others may be connected to the PC. Device has a problem Failure occurred in the device driver. This Device is disabled The device has been removed.
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Tests and Diagnostics 3.34.4.3 Test Procedure This section describes operation procedure of WinPE T&D. 1) Select the test item to run from Test Item and check it. (If you put a check mark in the ALL Item Check check box, all test items are checked.) 2) Select the test mode of each test.
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Tests and Diagnostics 3.34.4.4 Display of Test Result If the test ends successfully or the [STOP] button is clicked, the following Result screen is displayed. After confirming the result, click the [CLOSE] button to close the screen. After the display of the test result screen, the test result logs are saved to X drive. Note: WinPE is extracted on the RAM disk on drive X.
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Tests and Diagnostics 2) How to save log files The following is the procedure to save log files to an external media Test logs in the text format and HTML log files are saved to the external media. 2-1) Click the check box of the log file to save. If you click the [ALL Select] button, all the check boxes of the log files are checked.
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Tests and Diagnostics 2-3) If a destination confirmation message is displayed, click the [OK] button. 2-4) If the log file is successfully saved to the destination, the following confirmation screen is displayed and click the [OK] button. 2-5) After saving the log files, click the [Close] button to close the Management screen. 3-110 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics 3.34.5 System Utility Menu This section explains System Utility screen. 3.34.5.1 Explanation of Each Item ▼ Utility Item … A list of the utilities that this T&D supports ▼ Detail … Explanation of each utility is described. If you point to the utility which you wish to execute and click it, the utility starts.
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Tests and Diagnostics 3.34.5.2 USB Memory Creation Tool If the system is booted using the USB memory created in 3-5-2, the following screen is displayed. Press the arrow keys to operate on the multi-boot screen. Move the cursor to the desired item and press the Enter key. [WindowsPE T&D]: Starts up WindowsPE and then starts WinPE T&D.
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Tests and Diagnostics This utility extracts the contents of TOSHIBA Test & Diagnostic to the specified USB memory to provide the environment which allows you to start the test from the USB memory and conduct it. If the utility is executed, the following screen is displayed.
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Tests and Diagnostics 3.34.5.3 Display of SMART Information This utility lists the SMART information on the screen. Attribute and Worst values for each ID are also displayed. Since some HDDs do not have ID, these information are not displayed in that case. The following screen displays the SMART information of the first HDD.
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Tests and Diagnostics Each ID and its details are listed in the following table. Attribute Name Description Raw read error rate Read error rate Rate of errors which occur when the HDD reades data. Throughput performance Throuput performance Spin up time Start-up time of spindle mortor Averate time from turning the power on to starting spinning...
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Tests and Diagnostics UltraDMA CRC error count Number of CRC errors occurred during data transference in the UltraDMA mode DFh Load/Unload retry count Number of reloads of more than a certain amount of times 3-116 [CONFIDENTIAL]) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Tests and Diagnostics 3.34.6 Details of Each Test Function 3.34.6.1 HDD Physical Test 1) Test content This test handles the HDDs to the PC as physical unit and conducts read test to the target HDD to check whether it works or not. Up to first four HDDs connected to the PC can be the target of the test.
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Tests and Diagnostics ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen. The detail of the error is printed to the log of WinPE T&D. Move details are as shown below. Message Explanation Remarks...
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Tests and Diagnostics 3.34.6.2 HDD Logical Test 1) Test content This test first verifies that the files which exist on the drive recognized as the built-in HDD are read normally. During the verification operation, the status update is performed sequentially (display of file names in File Name) and when the verification reaches the last file, it is terminated.
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Tests and Diagnostics 3.34.6.3 Memory Test 1) Test content This test reserves free memory area in the main memory and performs Write, Read and Compare operation to the area to verify data validity. A test using burst transfer is also performed.
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Tests and Diagnostics 3) Result judgment ■In the case of PASS The PASS Count on the test screen is zoomed in and (OK) is displayed in the Result field on the WinPE T&D screen. ■In the case of FAIL The PASS Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen.
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Tests and Diagnostics 3.34.6.4 USB Test 1) Test content This test accesses a file on the disk in the USB device (USB Flash Memory) to verify the file validity. Create a file with the specified size in the USB device and delete the file after creating it. ■...
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Tests and Diagnostics 3) Result judgment This test is regarded as 1PASS when every access to the files in all of the devices connected to the PC is successful. If an error occurs even in a device, the error count is incremented. ■...
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Tests and Diagnostics 3.34.6.5 ODD Test 1) Test content This test reads the test data in the CD inserted on the CD drive (External CD driver is also possible) to verify the data integrity. During the verification operation, update of the read address is performed (displayed on the right side of the Addressing Data) and when the verification reaches the end of the data, it is terminated.
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Tests and Diagnostics ■ In the case of PASS The PASS Count on the test screen is zoomed in and (OK) is displayed in the Result field on the WinPE T&D screen. ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen.
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Tests and Diagnostics 3.34.6.6 WIRED LAN Test 1) Test content This test checks that normal communication can be performed with the built-in LAN card. To execute the test, it is necessary that Mac address for the LAN card should have been set and IP address should have been given to the machine.
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Tests and Diagnostics ■ In the case of FAIL The Error Count on the test screen is zoomed in and (NG) is displayed in the Result field on the WinPE T&D screen. The detail of the error is printed to the log of WinPE T&D. More details are as shown below. Message Explanation Remarks...
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Tests and Diagnostics 3.34.6.7 CPU Test 1) Test content This test performs arithmetic operation test to the CPU to verify the CPU operation. The test processes ALU and FPU operations and allows you to check that the results are correct. ■Simple Mode / Detail Mode Conduct the same test in both Simple mode and Detail mode.
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Tests and Diagnostics The detail of the error is printed to the log of WinPE T&D. More details are as shown below. Message Explanation Remarks The ALU test made an An error occurred error. duringprocessing of ALU. The FPU test made an An error occurred error.
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Tests and Diagnostics 3.34.6.8 VIDEO Test 1) Test content This test displays red, green, blue, white and black colors, circles, line gradation, ASCII characters and H pattern full screen. ■ Simple Mode This test mode displays red, green, blue, white and black colors, circles, line gradation, ASCII characters and H pattern full screen.■Detail Mode This test mode performs display of test items in the Simple mode as well as random drawing of circles, squares and lines.
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Tests and Diagnostics 3.34.6.9 FDD Test 1) Test content This test accesses a file on a floppy disk and verifies that the access can be made correctly. Create a file with the specified size on a floppy disk and delete the file after creating it Perform the test after inserting a floppy disk to the drive.
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Tests and Diagnostics Message Explanation Remarks Space Size Error. There is no sufficient free space This message also appears Code(xx) for the file with the specified size. when no floppy disk is in the xx indicates error code. floppy disk drive. Open File Error.
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Tests and Diagnostics 3.34.6.10 IEEE1394 Test 1) Test content This test accesses a file in the IEEE1394 device and verifies that the access can be made correctly. Create a file with the specified size in the IEEE1394 device and delete the file after creating ■...
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Tests and Diagnostics the WinPE T&D screen. The detail of the error is printed to the log of WinPE T&D. More details are as shown below. Message Explanation Remarks File Access Failed the file access Error.xx: xx indicates drive name. Space size There is no sufficient free space Error.Code(xx:)
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Tests and Diagnostics 3.34.6.11 TIMER Test 1) Test content Execute the test after adjusting the internal time and verify the accuracy of the timer after it passes the year 2000. ■ Simple Mode / Detail Mode Simple Mode tests at intervals of order 5 seconds. Detail Mode tests at intervals of order 10 seconds.
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Tests and Diagnostics 3) Result judgment Both of PASS and FAIL are not displayed anywhere on the TIMER screen. The result is reflected to the log on the WinPE T&D screen. ■ In the case of PASS The PASS Count display on the test screen is zoomed in and (OK) is displayed in the Result field on the WinPE T&D screen.
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Tests and Diagnostics 3.34.6.12 KEYBOARD Test 1) Test content The keyboard of PC is a test which judges whether it operates normally. ■Simple Mode / Detail Mode The same operation is carried out whichever it chooses. 2) Test screen The arrangement of a keyboard is displayed on the display of PC. TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-137...
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Tests and Diagnostics 1) If the press of a key is recognized correctly, the object key on a display will be eliminated. 2) When redoing a keyboard test, the "Refresh" button arranged at the screen lower left is pressed. Next, it returns to the state immediately after starting. Note: The check of the "FN"...
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Tests and Diagnostics The keyboard which can be tested is two kinds, "US Keyboard A4 Mode" and "US Keyboard A4 Mode+10Key Mode." When you test a keyboard with a ten key, choose "US Keyboard A4 Mode+10Key Mode" by the combo box of the keyboard layout upper left stage. TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-139...
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Tests and Diagnostics 3) Result judgment It is normal, if a keyboard test is done and all the keyboard layouts are eliminated. Press the "Pass" button with the judgment button at the upper right of a keyboard layout. Press the "Fail"...
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Tests and Diagnostics 3.34.6.13 Mouse Test 1) Test content The Mouse of PC is a test which judges whether it operates normally. ■Simple Mode / Detail Mode The same operation is carried out whichever it chooses. 2) Test screen If a mouse test start is carried out, the above-mentioned screen will be displayed. TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-141...
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Tests and Diagnostics 1) There is a test item to 1-9 of a mouse test screen. If applicable mouse operation is performed, a test item will disappear. Moreover, it is simultaneously displayed on the corresponding section of a right-hand side mouse illustration by coloring. 2) Press the "Refresh"...
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Tests and Diagnostics 3) Result judgment When all the test items of a mouse test disappear and it is normal, Please push the "Pass" button of a mouse test screen. Press the "Fail" button, when abnormal. A warning message is displayed, when the "Pass" button is pressed before the mouse test items 1-9 were all completed.
Tests and Diagnostics 3.35 DOS T&D 3.35.1 Configuration of Test Equipment The configuration of test equipment required for executing FreeDOS T&D is as follows: Note: Start the machine after connecting the FDD. If the FDD is connected to the machine after FreeDOS T&D started, it does not recognize the FDD. 3.35.1.1 Test device configuration Devices to be tested and Test devices (Abbreviated names)
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Tests and Diagnostics HDD : Hard disk drive KB : Keyboard FDD : Floppy disk drive 3.35.1.2 Test program configuration This test program is configured as below: TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-145...
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Tests and Diagnostics 3.35.1.3 Test program list The following table lists test items included in each test. Test name Test No. Sub No. Test item SYSTEM DMI read MEMORY Conventional memory Protected mode Cache memory(on/off) Stress test KEYBOARD Pressed key code display DISPLAY VRAM read/write for VGA Gradation for VGA...
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3.35.2 How to start T&D 3.35.2.1 Diagnostics main menu Set the TOSHIBA Test & Diagnostic CD to the ODD drive and turn the power of the system If you select Freedos on the BOOT selection screen then the test program is loaded and the following test selection screen is displayed.
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Tests and Diagnostics 3.35.2.2 Diagnostics test menu If you select [1] in the main menu, the following test screen is displayed. Use the Up or Down cursor key to select your desired test item and press the [Enter] key. [1] - [9]: Select the subtest menu described in section 4-2-3. [88]: Specifies the number of error retries.
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Tests and Diagnostics 2) HARD DISK TEST The following message will appear. Select the Hard Disk DRIVE to be tested, then press Enter. [1]:Drive 1 [2]:Drive 2 [3]:Drive 3 [4]:Drive 4 [0]:Drives 1 to 4 This message is used to select the error dump operation when a data compare error is detected.
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Tests and Diagnostics 3.35.2.3 Sub test menu If you select any test item from “DIAGNOSTICS TEST MENU”, the following sub menu is displayed. Use the Up or Down cursor key to select your desired item and press the [Enter] key. When you select any subtest item, you are taken to the test mode described in the detail of each test function in section 4-6.
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Tests and Diagnostics 3.35.3 Test Operating Procedure If you select any test item from the subtest menu and execute it, you are required to set the test mode. Set the test mode according to the following procedure. Use the Up and Down cursor keys to select an option for TEST LOOP and ERROR SOPT.
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Tests and Diagnostics [[ HALT OPERATION ]] 1:Test end …The test ended. Select a subtest. 2:Continue …The next step will be executed. 3:Retry …The error step will be retried. 3) Discontinuing a test If you press the [Ctrl] + [Alt] + [Break] keys during a test, the test is discontinued and the screen returns to the subtest menu described in section 3-31-4.2.3.
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Tests and Diagnostics 3.35.4 Error Code Status If an error occurs during any test, one of the following error codes is displayed. Device Name Code Status Common DATA COMPARE ERROR SYSTEM ROM - CHECKSUM ERROR ROM - SERIAL ID WRITE ERROR ROM - NOT SUPPORTED PS-SYSTEM ROM - SENSING ERROR(AC-ADAPT) ROM - SENSING ERROR(1st Batt)
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Tests and Diagnostics FDD - RECORD NOT FOUND FDD - DMA OVERRUN ERROR FDD - DMA BOUNDARY ERROR FDD - CRC ERROR FDD - FDC ERROR FDD - SEEK ERROR FDD - TIME OUT ERROR FDD - NOT DRIVE ERROR FDD - MEDIA REMOVED FDD - WRITE BUFFER ERROR HDD - HDC NOT RESET ERROR...
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Tests and Diagnostics 3.35.5 Task Function This T&D has three tasks, each of which has the following function. 3.35.5.1 Log Utilities(Task #5) This function logs error information generated while a test is in progress and stores the results in RAM. This function can store data on a floppy disk or USB memory The operation guide is displayed at the bottom of the screen and the error status names are displayed on the right side of the screen.
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Tests and Diagnostics 3.35.5.2 Running Test(Task #6) This test is a continuous test to be applied to the devices capable of unattended operation. The name of test device and the number of subtest being tested are displayed on the screen during a test.
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Tests and Diagnostics 3.35.5.3 FD & HD Utilities(Task #7) Run the utility on the floppy disk. If you select task No. [7], the following FDD utility selection menu is displayed. Use the Up and Down cursor keys to select your desired item and press the [Enter] key. If you press the [Esc] key or select [9], the screen returns to the main menu described in section 4.2.1.
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Tests and Diagnostics 3.35.6 Detail of Each Test Function 3.35.6.1 System Test 1) DMI data read This subtest displays the information in the Flash-ROM in the following format Model Name : XXXXXXXX Version Number : XXXXXXXX Serial Number : XXXXXXXX Model Number :...
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Tests and Diagnostics Test data = CCAA5533H, 8000000H Step 2: Byte Enable Test Write the data byte by byte to the initial address of the data in 64KB units and the initial data + 4, then read double words of the written data and compare the result with the original data.
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Tests and Diagnostics With regard to the test memory content, save the data to the test memory before the test and restore it to the former address after the test. (Coincidence assurance of the memory content) Details of Test Step 1: Sequential Write (Fixed pattern 1 MMX version 00005555AAAAFFFFh) : Sequential Read and Compare Step 3: Sequential Write (Fixed pattern 2 MMX version FFFFAAAA55550000h)...
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Tests and Diagnostics : JMP + Read and Compare Step 7: JMP+Write (Address pattern 2) 1/4. 3/4 increment 0, 1/2 decrement : JMP+Read and Compare Step11: Dword Transfer ( Data is an 32-bit shift data) : Step 11 bit-reversed pattern TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 3-161...
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Tests and Diagnostics 3.35.6.3 Keyboard Test 1) Pressed key code display When a key is pressed, the scan code, character code, and key top name are displayed on the screen in the format shown below. The 88 key (compatible with the 106 key) is not tested because this key operating in overseas mode uses the different character code table (Not for Japan model).
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Tests and Diagnostics 3.35.6.4 Display test Move the highlight bar to the subtest you want to execute and press Enter. 1) VRAM Read / Write for VGA This subtest writes the constant data (AAAAh and 5555h) to the video RAM. The data is read and compared to the original data.
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Tests and Diagnostics 3.35.6.5 Floppy Disk Test This subtest tests floppy disks. 1) Sequential read This subtest performs a Cyclic Redundancy Check (CRC) that continuously reads all the tracks (track: 0 to 39/0 to 79) on a floppy disk. 2) Sequential read / write This subtest continuously writes data pattern B5ADADh to all the tracks (track: 0 to 39/0 to 79) on a floppy disk.
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Tests and Diagnostics [ FDC Status ] XX XX XX XX XX FDC Status 0 : Result Status 0 1 : Result Status 1 2 : Result Status 2 3 : Cylinder Address 4 : Head Address 5 : Sector Address 6 :...
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Tests and Diagnostics [ Result Status 1 ] EN : End of Cylinder DE : Data error OR : Over run (DMAC) ND : No data NW : Not writable MA : Missing address mark [ Result Status 2 ] CM :...
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Tests and Diagnostics 3.35.6.6 Hard Disk Test 1) Sequential read This subtest performs a forward read operation (0 to Maximum) by 63 sectors. 2) Address uniqueness This subtest writes unique address data to each sector of the HDD track-by-track. The data written to each sector is then read and compared with the original data.
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Tests and Diagnostics 5) Partial read This subtest reads 1GB data that is in minimum, middle and maximum address of the HDD area. 6) Write specified address This subtest writes specified data to a specified cylinder and head on the HDD. 7) Read specified address This subtest reads data, which has been written to a specified cylinder and head on the HDD.
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Tests and Diagnostics [HDC Status] : P – 1F7h Name Function 0: HDC is ready. BSY(busy) 1: HDC is busy. 0: HDD does not accept the command. DRY(drive ready) 1: HDD is ready. 0: Write is successful DWF(write fault) 1: Write error 0: Seek error DSC(seek complete)...
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Tests and Diagnostics [Error register] P – 1F1h Name Function BBK(BadBlockMark) 0: Not used 1: Defective block mark detection. 0: No uncorrectable data error UNC(uncorrectable) 1: Uncorrectable data occurrence - - - 0: Not used 1: No ID field (identification) - - - 0: Not used ABT(about)...
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Tests and Diagnostics 3.35.6.7 Real timer test 1) Real time This subtest sets and displays the calendar or clock function. 2) Backup memory This subtest writes the data for 1bit ON (01, 02, 04…80h) and 1bit OFF (FE, FB, FB…7Fh) and AAh, 55h to 114 bytes of addresses from 0E to 7Fh, reads the written data and compares the result with the original data.
Tests and Diagnostics 3.36 Maintenance (WinPE&FreeDos) Test Program Supplementary Information 3.36.1 Details of HTML Log File This section provides details of the HTML log file stored in the storage. 3.36.1.1 System Information The following table lists system information of the PC that Item Name Description Manufucture r...
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Tests and Diagnostics Physical Memory Capacity (MB) of memory which is installed in PC NetWork0 Name of LAN card. Only the first LAN card is displayed on the screen. MAC address Mac address of LAN card IDE HDD Name of the first IDE HDD and its capacity (GB) IDE HDD Name of the second IDE HDD and its capacity (GB) 1394 Disk...
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Tests and Diagnostics 3.36.1.3 Test Result The following table lists the test results. If an error occurs during a test, the line of the test on the screen is displayed in red color. Item Name Description Test Name Name of test Test Information Brief explanation of each test Pass Count...
Tests and Diagnostics 3.37 Maintenance (WinPE&FreeDos) Test Program Supplementary Information 3.37.1 Outline Describes notices and restrictions on using this program 3.37.2 Notices and Restrictions (Win PE T&D) 1) CPU Stress When the CPU stress checkbox is checked, it is recommended that this test be conducted in the Simple mode.
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Tests and Diagnostics 6) Boot Media If the system is booted from the CD when both the CD and the USB memory that contain WinPE T&D are connected to the PC, T&D in the USB memory starts up. Also, when a bootable CD is not inserted in the CD drive when the system is booted from the USB memory, the ODD test fails with an error because the ODD test file is only contained in this CD.
4.1 Overview 4 Replacement Procedures Replacement Procedures Overview This chapter describes the procedure for removing and replacing the field replaceable units (FRUs) in the PC. It may not be necessary to remove all the FRUs in order to replace one. The chart below provides a guide as to which other FRUs must be removed before a particular FRU can be removed.
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4 Replacement Procedures 4.1 Overview Please prepare required parts in advance, when replacing the following items. Parts List ITEM PART NAME Quantity ITEM No 60,60-A COVER ASSY COVER ASSY TOUCH PAD Parts List ITEM PART NAME Quantity ITEM No LCD COVER ASSY HD CAMERA MODULE LCD COVER W-LAN ANTENNA...
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4.1 Overview 4 Replacement Procedures The main parts in this manual are indicated in the part list by the following names. Parts List Manual NAME PART NAME ITEM No System board PCB ASSY FGNSYx IC CP80617004119AE SLBNB IC CP80617004122AG SLBMD IC CP80617003981AH SLBPD 02-A IC CP80617004161AD SLBPN...
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Please read the following safety instructions before disassembling the computer and always follow the instructions while working on the computer. DANGER: 1) Always use the genuine battery that is authorized by Toshiba or compatible with the unit. Since other battery packs have different specifications, they may be incompatible with the unit, and may burst or explode.
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4.1 Overview 4 Replacement Procedures Before You Begin Take note of the following points before starting work. Always remove the AC adapter and battery pack before commencing any of the procedures. The procedure for removing the battery pack is described in section “4.2. Battery Pack”. 1.
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4 Replacement Procedures 4.1 Overview Disassembly Procedure Four main types of cable connector are used. • Pressure plate connector • Spring connector • Back flip connector • Normal pin connector For pressure plate connectors, slide the pressure plate holding tags on both sides of the plastic pressure plate on the connector and pull the cable out from the connector.
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4.1 Overview 4 Replacement Procedures Assembly Procedures After the computer has been disassembled and the part that caused the fault has been repaired or replaced, the computer must be reassembled. Take note of the following general points when assembling the computer. •...
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CAUTION: Overtightening can damage components and screws; undertightening can result in electrical shorts or other damage if screws or components come loose. NOTE: Toshiba recommends that you use an electric screw driver for quick and easy operations. • M2 (2mm) 0.167 N·m (1.7 kgf·cm)
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4.1 Overview 4 Replacement Procedures Grip Color Some screws have a colored grip area to help you determine the length of the screw. [Normal grip] • Even numbered length screws: Brown • Odd numbered length screws: White Grip area • Special length screw: Blue [Special grip] •...
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4 Replacement Procedures 4.1 Overview Screw Notation To make maintenance of the computer easier, markings of the kinds of the screws including the types and lengths of the screws are indicated on the computer body. Format: Screw type + Screw length (mm) Screw shape B: Bind screw F: Flat head screw...
4.2 Battery pack 4 Replacement Procedures Battery pack Removing the Battery pack To remove the battery pack, follow the steps below and refer to Figure 4-1. CAUTION: Take care not to short circuit the terminals when removing the battery pack. Similarly, do not drop, knock, scratch, disassemble, twist, or bend the battery pack.
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Dispose always the used battery pack in accordance with the laws and ordinances of your local authority. Use only the batteries approved by Toshiba. NOTE: Check the battery’s terminals visually. If they are dirty, wipe them clean with a dry cloth.
4.3 ExperssCard/Bridge media/Smart card 4 Replacement Procedures ExperssCard/Bridge media/Smart card 4.3.1 ExpressCard Removing the ExpressCard To remove the ExpressCard, follow the steps below and refer to Figure 4-2. CAUTION: Insert or remove an ExpressCard in accordance with any instructions in the ExpressCard manual or the manuals of the computer system you are using.
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4 Replacement Procedures 4.3 ExperssCard/Bridge media/Smart card 4.3.2 Bridge media (SD/SDHC memory card, miniSD/microSD Card, Memory Stick (PRO/PRO Duo), xD-PictureCard and MultiMediaCard) Removing the Bridge media To remove the Bridge media, follow the steps below and refer to Figure 4-3. CAUTION: Insert or remove a Bridge media in accordance with any instructions in each Bridge Media manual or the manuals of the computer system you are using.
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4.3 ExperssCard/Bridge media/Smart card 4 Replacement Procedures 4.3.3 Smart Card Removing the Smart Card To remove the Smart Card, follow the steps below and refer to Figure 4-4. CAUTION: Insert or remove a Smart Card in accordance with any instructions in the Smart Card manual or the manuals of the computer system you are using.
4 Replacement Procedures 4.4 Memory module Memory module Removing the Memory module To remove the memory module, confirm that the computer is shut down. Then follow the steps below and refer to Figure 4-5 and 4-6. CAUTION: When removing the memory module, make sure the computer is powered off. Removing a memory module with the power on might damage the module or the computer itself.
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4.4 Memory module 4 Replacement Procedures 4. Open the left and right latches outside and remove the memory module(s). Latch Latch Slot B Slot A Memory module Figure 4-6 Removing the memory module TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-17...
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4 Replacement Procedures 4.4 Memory module Installing the Memory module To install the memory module, confirm that the computer is shut down. Then follow the steps below and refer to Figure 4-5 and 4-6. CAUTION: When installing the memory module, make sure the computer is powered off. Inserting a memory module with the power on might damage the module or the computer itself.
4.5 Fin cover 4 Replacement Procedures Fin cover NOTE: When repairing the PC, turn up the plastic film and clean the cooling fin with a vacuum cleaner or other cleaning tool. Plastic film Do not use cotton sticks and tweezers to remove dusts. It may cause the cooling module problem or dusts stuffed.
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4 Replacement Procedures 4.5 Fin cover Installing the Fin cover To install the fin cover, follow the steps below and refer to Figure 4-7. 1. Set the fin cover into the slot and slide it to engage the hook. 4-20 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
4.6 SIM card 4 Replacement Procedures SIM card Removing the SIM card To remove the SIM card, follow the steps below and refer to Figure 4-8 to 4-10. 1. Loosen the screw fixing the SIM card cover. 2. Remove the SIM card cover. SIM card cover Screw Figure 4-8 Removing the SIM card cover...
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4 Replacement Procedures 4.6 SIM card 3. Slide the SIM card release latch in the direction as shown in the figure below. 4. Turn up the SIM card holder in the direction as shown in the figure below. SIM card release latch SIM card holder Figure 4-9 Removing the SIM card (1) 5.
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4.6 SIM card 4 Replacement Procedures Installing the SIM card To install the SIM card, follow the steps below and refer to Figure 4-8 to 4-10. 1. Set the SIM card into the SIM card holder. 2. Lay the SIM card holder down and lock the SIM card release latch while sliding it in the opposite direction as shown in the figure 4-9.
4 Replacement Procedures 4.7 HDD Removing the HDD To remove the HDD, follow the steps below and refer to Figure 4-11 to 4-13. CAUTION: Take care not to press on the top or bottom of a HDD. Pressure may cause the data loss or damage to the device.
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4.7 HDD 4 Replacement Procedures 3. Remove the HDD assembly from the slot and disconnect it from the connector on the system board. HDD assembly Guide Figure 4-12 Removing the HDD assembly TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-25...
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4 Replacement Procedures 4.7 HDD 4. Remove the following screws and separate the HDD and HDD holder. • ×4 M3.0×4C FLAT HEAD screw M3.0×4C FLAT HEAD M3.0×4C FLAT HEAD HDD Holder M3.0×4C FLAT HEAD Figure 4-13 Removing the HDD 4-26 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4.7 HDD 4 Replacement Procedures Installing the HDD To install the HDD, follow the steps below and refer to Figure 4-11 to 4-13. 1. Set the HDD to the HDD Holder and secure them with the following screws. • ×4 M3.0×4C FLAT HEAD screw NOTE: When replacing the HDD holder with a new one, stick the HDD cushion to the...
4 Replacement Procedures 4.8 Keyboard Keyboard Removing the Keyboard To remove the keyboard, follow the steps below and refer to Figure 4-14 to 4-16. CAUTION: As the keytop may fall out, when handling the keyboard always hold it by the frame and do not touch the keytop.
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4.8 Keyboard 4 Replacement Procedures 4. Remove the following screws securing the keyboard. • ×2 M2.0×3C BIND screw Latch M2.0×3C BIND M2.0×3C BIND Latch Figure 4-15 Removing the keyboard (1) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-29...
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4 Replacement Procedures 4.8 Keyboard 5. Lift the top edge of the keyboard while releasing the latches and turn the keyboard face down on the palm rest. 6. Disconnect the keyboard flexible cable from the connector CN3230 on the system board and remove the keyboard.
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4.8 Keyboard 4 Replacement Procedures Installing the Keyboard To install the keyboard, follow the steps below and refer to Figure 4-14 to 4-16. 1. Place the keyboard face down on the palm rest and connect the keyboard flexible cable to the connector CN3230 on the system board. 2.
4 Replacement Procedures 4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) Optical disk drive (DVD-ROM/DVD-Super Multi drive) Removing the Optical disk drive To remove the optical disk drive, follow the steps below and refer to Figure 4-17 to 4-19. CAUTION: When the optical disk inside the optical disk drive can not be ejected because of some failure, open the disc tray by inserting a slender object (about 15 mm) such as a straightened paper clip into the eject hole near the eject button.
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4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 4 Replacement Procedures 1. Close the display and turn over the computer. 2. Remove the following screw securing the optical disk drive assembly. • ×1 M2.5×5B FLAT HEAD screw M2.5×5B FLAT HEAD Figure 4-17 Removing the optical disk drive assembly (1) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-33...
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4 Replacement Procedures 4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 3. Turn the computer face up and open the display. 4. Remove the optical disk drive assembly from the slot while pushing it in the direction as shown in the figure below. Optical disk drive assembly Figure 4-18 Removing the optical disk drive assembly (2) 4-34...
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4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) 4 Replacement Procedures 5. Remove the following screws and ODD rear bracket from the optical disk drive. • ×2 M2.0×3C BIND screw ODD rear bracket Optical disk drive M2.0×3C BIND Figure 4-19 Removing the optical disk drive TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-35...
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4 Replacement Procedures 4.9 Optical disk drive (DVD-ROM/DVD-Super Multi drive) Installing the Optical disk drive To install the Optical disk drive, follow the steps below and refer to Figure 4-17 to 4-19. NOTE: When installing a new optical disk drive, set the ODD bezel to the optical disk drive while securing the latches.
4.10 SW board 4 Replacement Procedures 4.10 SW board Removing the SW board To remove the SW board, follow the steps below and refer to Figure 4-20. 1. Turn up the insulator (LCD CONN INSULATOR) and disconnect the SW board FFC from the connector CN9500 on the system board.
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4 Replacement Procedures 4.10 SW board Installing the SW board To install the SW board, follow the steps below and refer to Figure 4-20. 1. Slide the SW board into the guide to set it. 2. Turn up the insulator (LCD CONN INSULATOR) and connect the SW board FFC to the connector CN9500 on the system board.
4.11 Wireless LAN card 4 Replacement Procedures 4.11 Wireless LAN card Removing the Wireless LAN card To remove the wireless LAN card, follow the steps below and refer to Figure 4-21. 1. Disconnect the wireless LAN antenna cables from the wireless LAN card (white cable from “A”...
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4 Replacement Procedures 4.11 Wireless LAN card Installing the Wireless LAN card To install the wireless LAN card, follow the steps below and refer to Figure 4-21. 1. Insert the wireless LAN card to the connector on the system board slantwise. 2.
4.12 Cover assembly and Base assembly 4 Replacement Procedures Replacement Procedures 4.12 Cover assembly and Base assembly Removing the Cover assembly and Base assembly To remove the cover assembly and base assembly, follow the steps below and refer to Figure 4-22 to 4-26.
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4 Replacement Procedures 4.12 Cover assembly and Base assembly 3. Remove the following screws. • ×11 (“8” in the figure below) M2.5×8B FLAT HEAD screw • ×1 (“12” in the figure below) M2.5×12B FLAT HEAD screw • ×1 (“5” in the figure below) M2.5×5B FLAT HEAD screw “8”...
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4.12 Cover assembly and Base assembly 4 Replacement Procedures 4. Turn over the computer and open the display. 5. Turn up the insulator (LCD CONN INSULATOR) and disconnect the LCD harness from the connector CN5300 on the system board. 6. Disconnect the FS board FFC and camera harness from the connector CN9550 and CN9540 on the system board.
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4 Replacement Procedures 4.12 Cover assembly and Base assembly 7. Remove the following screws. • ×5 M2.5×8B FLAT HEAD screw • ×3 M2.5×12B FLAT HEAD screw M2.5x12B FLAT HEAD M2.5x8B FLAT HEAD M2.5x8B FLAT HEAD M2.5x12B FLAT HEAD M2.5x8B FLAT HEAD Figure 4-25 Removing the cover assembly and base assembly (4) 4-44 [CONFIDENTIAL]...
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4.12 Cover assembly and Base assembly 4 Replacement Procedures 8. Separate the cover assembly and base assembly while releasing the latches. Cover assembly Base assembly Figure 4-26 Removing the cover assembly and base assembly (5) CAUTION: When separating the cover assembly and base assembly, lift the cover assembly up right above.
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4 Replacement Procedures 4.12 Cover assembly and Base assembly Installing the Cover assembly and Base assembly To install the cover assembly and base assembly, follow the steps below and refer to Figure 4-22 to 4-26. 1. Place the cover assembly on the base assembly and secure them with the following screws.
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4.12 Cover assembly and Base assembly 4 Replacement Procedures 4. Turn over the computer and secure the cover assembly and base assembly with the following screws. • ×11 (“8” in the Figure 4-23) M2.5×8B FLAT HEAD screw • ×1 (“12” in the Figure 4-23) M2.5×12B FLAT HEAD screw •...
4 Replacement Procedures 4.13 MDC/USB board 4.13 MDC/USB board Removing the MDC/USB board To remove the MDC/USB board, follow the steps below and refer to Figure 4-27 to 4-29. MDC model 1. Take out the RJ11 harness from the slot of the base assembly. 2.
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4.13 MDC/USB board 4 Replacement Procedures M2.5x6C Tapping RJ11 harness MDC/USB board Modem/USB harness Connector (Back of the MDC/USB board) CN9770 (Back of the MDC/USB board) CN9570 (Back of the system board) Figure 4-27 Removing the MDC/USB board (1) (MDC model) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-49...
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4 Replacement Procedures 4.13 MDC/USB board 6. Remove the following screws and disconnect the MDC module from the connector CN3010 on the MDC/USB board. • ×2 M2.0×3C BIND screw M2.0x3C BIND MDC module CN3010 Figure 4-28 Removing the MDC/USB board (2) (MDC model) 4-50 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4.13 MDC/USB board 4 Replacement Procedures USB model 1. Remove the following screw securing the USB board. • ×1 M2.5×6C Tapping screw 2. Peel off the acetate tape. 3. Disconnect the USB harness from the connector CN9770 on the USB board and connector CN9570 on the system board.
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4 Replacement Procedures 4.13 MDC/USB board Installing the MDC/USB board To install the MDC/USB board, follow the steps below and refer to Figure 4-27 to 4-29. MDC model 1. Connect the MDC module to the connector CN3010 on the MDC/USB board. 2.
4.14 RTC battery 4 Replacement Procedures 4.14 RTC battery CAUTION: Risk of explosion if battery is replaced by an incorrect type. Dispose of used batteries according to the laws and ordinances of your local authority. Removing the RTC battery To remove the RTC battery, follow the steps below and refer to Figure 4-30. 1.
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4 Replacement Procedures 4.14 RTC battery Installing the RTC battery To install the RTC battery, follow the steps below and refer to Figure 4-30. 1. Open the insulator (RTC BATT INSULATOR) and set the RTC battery in place. 2. Close the insulator (RTC BATT INSULATOR) to fix the RTC battery. 3.
4.15 Bluetooth module 4 Replacement Procedures 4.15 Bluetooth module Removing the Bluetooth module To remove the Bluetooth module, follow the steps below and refer to Figure 4-31. 1. Disconnect the Bluetooth harness from the connector CN4440 on the system board. 2.
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4 Replacement Procedures 4.15 Bluetooth module Installing the Bluetooth module To install the Bluetooth module, follow the steps below and refer to Figure 4-31. 1. Connect the Bluetooth harness to the connector on the Bluetooth module. 2. Set the Bluetooth module under the guides and engage the latches. 3.
4.16 Smart card slot 4 Replacement Procedures 4.16 Smart card slot Removing the Smart card slot To remove the smart card slot, follow the steps below and refer to Figure 4-32. 1. Disconnect the smart card FPC from the connector CN2170 on the system board. 2.
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4 Replacement Procedures 4.16 Smart card slot Installing the Smart card slot To install the smart card slot, follow the steps below and refer to Figure 4-32. 1. Slide the smart card slot under the guides until the hook is engaged. 2.
4.17 Jack/3G/Express board/Microphone/3G card 4 Replacement Procedures 4.17 Jack/3G/Express board/Microphone/3G card Removing the Jack/3G/Express board/Microphone/3G card To remove the jack/3G/Express board/Microphone/3G card, follow the steps below and refer to Figure 4-33 to 4-35. 1. Disconnect the jack/3G/Express board FPC from the connector CN9530 on the system board.
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4 Replacement Procedures 4.17 Jack/3G/Express board/Microphone/3G card 4. Take out the microphone from the slot of the base assembly. 5. Remove the jack/3G/Express board (with the microphone). 6. Disconnect the jack/3G/Express board FPC from the connector CN9630 on the jack/3G/Express board. 7.
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4.17 Jack/3G/Express board/Microphone/3G card 4 Replacement Procedures 8. Turn over the jack/3G/Express board. 9. Remove the following screws securing the 3G card. • ×2 M2.0×3C BIND screw 10. Disconnect the 3G card from the connector on the jack/3G/Express board. M2.0x3C BIND 3G card Figure 4-35 Removing the 3G card TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4 Replacement Procedures 4.17 Jack/3G/Express board/Microphone/3G card Installing the Jack/3G/Express board/Microphone/3G card To install the jack/3G/Express board/microphone/3G card, follow the steps below and refer to Figure 4-33 to 4-35. 1. Insert the 3G card to the connector on the jack/3G/Express board slantwise. 2.
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4.17 Jack/3G/Express board/Microphone/3G card 4 Replacement Procedures 9. Secure the jack/3G/Express board with the following screw. • ×1 M2.5×6C Tapping screw TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-63...
4 Replacement Procedures 4.18 RGB/USB board 4.18 RGB/USB board Removing the RGB/USB board To remove the RGB/USB board, follow the steps below and refer to Figure 4-36 and 4-37. 1. Disconnect the RGB harness from the connector CN9611 on the RGB/USB board. 2.
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4.18 RGB/USB board 4 Replacement Procedures 3. Take out the DC-IN harness from the slot of the base assembly. 4. Take out the RGB/USB board from the slot of the base assembly. (USB harness is still connected to the back of the RGB/USB board.) 5.
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4 Replacement Procedures 4.18 RGB/USB board Installing the RGB/USB board To install the RGB/USB board, follow the steps below and refer to Figure 4-36 and 4-37. 1. Connect the USB harness to the connector CN9610 on the RGB/USB board and arrange the harness in place.
4.19 System board 4 Replacement Procedures 4.19 System board CAUTION: When replacing with a new system board, the following procedures must be executed. (1) Before replacing the system board, execute subtest02 “DMI ggginformation save” in 3.3 Setting of the hardware configuration of gggChapter 3 Test program in order to save the DMI information from gggsystem board to floppy disk.
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4 Replacement Procedures 4.19 System board Removing the System board To remove the system board, follow the steps below and refer to Figure 4-38 and 4-39. 1. Take out the RJ45 harness from the slot of the base assembly. 2. Peel off the insulator (SQUARE INSULATOR). 3.
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4.19 System board 4 Replacement Procedures 5. Disconnect the RGB harness from the connector CN9511 on the system board. 6. Turn up the insulator (HNS HOLD RJ INSULATOR) and disconnect the RJ45 harness from the connector CN4050 on the system board. 7.
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4 Replacement Procedures 4.19 System board Installing the System board To install the system board, follow the steps below and refer to Figure 4-38 and 4-39. 1. Connect the 3G power harness to the connector CN9531 on the back of the system board.
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4.19 System board 4 Replacement Procedures 4. Turn up the insulator (HNS HOLD RJ INSULATOR) and connect the RJ45 harness to the connector CN4050 on the system board. NOTE: When replacing a system board with a new one, stick the HNS HOLD RJ INSULATOR in place.
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4 Replacement Procedures 4.19 System board 7. Set the system board into the base assembly in place and secure them with the following screws. • ×2 M2.5×6C Tapping screw NOTE: When installing the system board to the base assembly, do not pinch the harnesses.
4.20 CPU/Fin/DC fan 4 Replacement Procedures 4.20 CPU/Fin/DC fan Removing the CPU/Fin/DC fan To remove the CPU/fin/DC fan, follow the steps below and refer to Figure 4-40 to 4-42. 1. Disconnect the fan harness from the connector CN3380 on the system board. 2.
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4 Replacement Procedures 4.20 CPU/Fin/DC fan M2.0x4B BIND M2.0x4B BIND M2.0x4B BIND Fan harness Fin (with DC fan) Cool sheet CN8800 CN3380 DC-IN harness Cool sheet Figure 4-40 Removing the fin/DC fan (1) 4-74 [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4.20 CPU/Fin/DC fan 4 Replacement Procedures 4. Remove the fan hood. 5. Remove the following screws and separate the DC fan and fin. • ×2 M2.0×3C BIND screw M2.0x3C BIND Fan hood DC fan Figure 4-41 Removing the fin/DC fan (2) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-75...
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4 Replacement Procedures 4.20 CPU/Fin/DC fan 6. Unlock the CPU by turning the cam counterclockwise on the CPU socket by 180 degrees with a flat-blade screwdriver. 7. Remove the CPU. Figure 4-42 Removing the CPU CAUTION: When removing the CPU, lift it up right above. Otherwise, pins of the CPU may be damaged.
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4.20 CPU/Fin/DC fan 4 Replacement Procedures Installing the CPU/fin/DC fan To install the CPU/fin/DC fan, follow the steps below and refer to Figure 4-40 to 4-44. 1. Make sure that the cam of the CPU socket is in the unlock (OPEN) position. 2.
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4 Replacement Procedures 4.20 CPU/Fin/DC fan 4. When silicon grease is already applied to the CPU, wipe them off with a cloth in advance. 5. Apply new grease (Shin-Etsu Chemical Co. X-23-7921-5) on the CPU using a special syringe as shown in the following figure. Apply quarter of scale (0.25ml) of grease evenly on the CPU chip.
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4.20 CPU/Fin/DC fan 4 Replacement Procedures 10. Set the fin (with the DC fan) in place and secure it with the following screws. • ×8 M2.0×4B BIND screw NOTE: When securing the fin, be sure to secure the screws in the order of the number marked on the fin.
4 Replacement Procedures 4.21 Speaker 4.21 Speaker Removing the Speaker To remove the speaker, follow the steps below and refer to Figure 4-45. 1. Peel off the acetate tapes. 2. Remove the speakers (left and right) from the speaker slots and the speaker harness from the guides.
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4.21 Speaker 4 Replacement Procedures Installing the Speaker To install the speaker, follow the steps below and refer to Figure 4-45. 1. Set the speakers (left and right) into the speaker slots. NOTE: Set the speakers into the speaker slots in correct direction. 2.
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4 Replacement Procedures 4.21 Speaker NOTE: When replacing a base assembly with a new one, set the following parts as shown in the figure below. LCD gum sheet LED lens 2P (External VGA model only) (Stick the BLIND2P INSULATOR on the LED lens 2P.) WL switch Knob Gasket (External VGA model only)
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4.21 Speaker 4 Replacement Procedures TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-83...
4 Replacement Procedures 4.22 Touch pad/Fingerprint sensor board Replacement Procedures 4.22 Touch pad/Fingerprint sensor board Removing the Touch pad/Fingerprint sensor board To remove the touch pad/fingerprint sensor board, follow the steps below and refer to Figure 4-46 to 4-50. 1. Peel off the acetate tapes. 2.
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4.22 Touch pad/Fingerprint sensor board 4 Replacement Procedures 4. Turn up the insulator (TPAD LOW INSULATOR) and remove the following screws. • ×4 M2.0×3C S-THIN HEAD screw 5. Remove the touch pad plate (with the fingerprint sensor board). M2.0x3C S-THIN HEAD M2.0x3C S-THIN HEAD Touch pad plate Insulator...
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4 Replacement Procedures 4.22 Touch pad/Fingerprint sensor board 6. Remove the following screws and separate the fingerprint sensor board and touch pad plate. • ×2 M2.0×3C S-THIN HEAD screw M2.0x3C S-THIN HEAD Fingerprint sensor board M2.0x3C S-THIN HEAD Touch pad plate Figure 4-48 Removing the fingerprint sensor board 4-86 CONFIDENTIAL]...
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4.22 Touch pad/Fingerprint sensor board 4 Replacement Procedures 7. Remove the following screws and pad button. • ×2 M2.0×3C S-THIN HEAD screw M2.0x3C S-THIN HEAD Pad button Figure 4-49 Removing the touch pad (3) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-87...
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4 Replacement Procedures 4.22 Touch pad/Fingerprint sensor board 8. Peel off the touch pad. NOTE: Do not reuse the removed touch pad. Be sure to use a new touch pad. Touch pad Figure 4-50 Removing the touch pad (4) Please prepare required parts in advance, when replacing the following item. Parts List ITEM PART NAME...
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4.22 Touch pad/Fingerprint sensor board 4 Replacement Procedures Installing the Touch pad/Fingerprint sensor board To install the touch pad/fingerprint sensor board, follow the steps below and refer to Figure 4-46 to 4-50. 1. Stick a new touch pad in place. 2.
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4 Replacement Procedures 4.22 Touch pad/Fingerprint sensor board 4. Set the touch pad plate (with the fingerprint sensor board) in place. NOTE: When replacing the touch pad plate with a new one, stick the insulator (TPAD LOW INSULATOR) to the touch pad plate in place. TPAD LOW INSULATOR 5.
4.23 LCD unit 4 Replacement Procedures 4.23 LCD unit Removing the LCD unit To remove the LCD unit, follow the steps below and refer to Figure 4-51 to 4-57. 1. Peel off the insulators (SQUARE INSULATOR and HNS 3G INSULATOR). NOTE: Do not reuse the removed SQUARE INSULATOR.
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4 Replacement Procedures 4.23 LCD unit 3. Turn over the cover assembly and open the display. 4. Release the LCD harness, camera harness, wireless LAN antenna cables and 3G antenna cables from the guides. Camera harness Wireless LAN antenna cable LCD harness 3G antenna cable Figure 4-52 Removing the LCD unit (2)
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4.23 LCD unit 4 Replacement Procedures 5. Remove the following screws and separate the LCD assembly and cover assembly. • ×4 M2.5×5B FLAT HEAD screw M2.5x5B FLAT HEAD LCD assembly M2.5x5B FLAT HEAD Cover assembly Guide Figure 4-53 Removing the LCD unit (3) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-93...
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4 Replacement Procedures 4.23 LCD unit 6. Peel off the LCD mask cushions and remove the following screws. • ×2 M2.5×5B FLAT HEAD screw 7. Make the brake hinge R flat and remove the LCD mask while releasing the latches. NOTE: Release the latches from the outside of the LCD mask.
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4.23 LCD unit 4 Replacement Procedures 8. Peel off the acetate tape. 9. Release the harnesses. 10. Turn the brake hinge 90 degrees. 11. Remove the following screws and stand the LCD unit. Be careful that the LCD harness is connected to the connector on the back of the LCD unit.
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4 Replacement Procedures 4.23 LCD unit 12. Peel the pull tape, and disconnect the LCD harness from the connector on the LCD unit. LCD unit Connector LCD harness Pull tape Figure 4-56 Removing the LCD harness 4-96 CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4.23 LCD unit 4 Replacement Procedures 13. Remove the following screws and separate the LCD unit and Brake hinges. • ×4 M2.0×3C BIND screw Brake hinge R M2.0x3C BIND Brake hinge L LCD unit M2.0x3C BIND Figure 4-57 Removing the LCD unit (5) TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-97...
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4 Replacement Procedures 4.23 LCD unit Installing the LCD unit To install the LCD unit, follow the steps below and refer to Figure 4-51 to 4-57. 1. Set the brake hinges to the LCD unit and secure them with the following screws. •...
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4.23 LCD unit 4 Replacement Procedures 5. Arrange the harness under the guides of the LCD cover. NOTE: Arrange the LCD harness as shown in the figure below. TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-99...
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4 Replacement Procedures 4.23 LCD unit 6. Stick the acetate tape in place. NOTE: Stick the acetate tape as shown in the figure below. 4-100 CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4.23 LCD unit 4 Replacement Procedures 7. Make the brake hinge R flat. 8. Set the LCD mask to the LCD assembly while engaging the latches. NOTE: When setting the LCD mask, be careful not to pinch the harnesses. Do not pinch the harnesses. Do not pinch the harnesses.
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4 Replacement Procedures 4.23 LCD unit 12. Arrange the LCD harness, camera harness, wireless LAN antenna cables and 3G antenna cables to the guides of the cover assembly. NOTE: Arrange the harnesses as shown in the figure below. 3G antenna cable (red) 3G antenna cable (blue) Wireless LAN antenna cable (gray)
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4.23 LCD unit 4 Replacement Procedures 13. Close the display and turn over the cover assembly. 14. Pass the 3G antenna cables through the hole of the cover assembly. 15. Arrange the 3G antenna cables under the guides. 16. Stick the insulators (SQUARE INSULATOR and HNS 3G INSULATOR) in place. TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-103...
4 Replacement Procedures 4.24 Camera module/Wireless LAN antenna/3G antenna 4.24 Camera module/Wireless LAN antenna/3G antenna Removing the Camera module/Wireless LAN antenna/3G antenna To remove the camera module/wireless LAN antenna/3G antenna, follow the steps below and refer to Figure 4-58 and 4-59. 1.
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4.24 Camera module/Wireless LAN antenna/3G antenna 4 Replacement Procedures 3. Peel off the wireless LAN antennas, 3G antennas and camera harness from the LCD cover. NOTE: Do not reuse the removed wireless LAN antennas and 3G antennas. Be sure to use new wireless LAN antenna or 3G antenna.
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4 Replacement Procedures 4.24 Camera module/Wireless LAN antenna/3G antenna Installing the Camera module/Wireless LAN antenna/3G antenna To install the camera module/wireless LAN antenna/3G antenna, follow the steps below and refer to Figure 4-58 and 4-59. 1. Stick new wireless LAN antennas in place. 2.
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4.24 Camera module/Wireless LAN antenna/3G antenna 4 Replacement Procedures 5. Peel off a protection sheet from a new camera module. CAUTION: Peel off the protection sheet with care of the followings: 6. Stick the camera cushion and square cushion on the LCD mask. NOTE: Stick the camera cushion and square cushion as shown in the figure below.
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4 Replacement Procedures 4.24 Camera module/Wireless LAN antenna/3G antenna CAUTION: Arranging the wireless LAN antennas, 3G antenna and camera module with care of the followings: <Wireless LAN model> 4-108 CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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4.24 Camera module/Wireless LAN antenna/3G antenna 4 Replacement Procedures <3G model> TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] 4-109...
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4 Replacement Procedures 4.24 Camera module/Wireless LAN antenna/3G antenna <Camera model> 4-110 CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Appendices App-ii [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (XXX-XXX)
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Appendices Appendix Contents Appendix A Handling the LCD Module ................A-1 Appendix B Board Layout ....................B-1 System board (FGQSY*/FGWSY*) Front View...........B-1 System board (FGQSY*/FGWSY*) Back View ...........B-3 USB/RGB board (FGQRG */ FGWRG *) View ...........B-5 Finger/Touch Pad Button board (FGQFS*/FGWFS*) View .........B-6 USB board (FGQUS*/ FGWUS*) View: Non Modem model only ......B-7 Modem/USB board (FGVMD*) View: Modem model only ........B-8 JACK/3G/Express board (FGQJK*/ FGWJK*) View:..........B-9...
Appendix A Handling the LCD Module Appendices Appendix A Appendix A Handling the LCD Module Precautions for handling the LCD module The LCD module can be easily damaged during assembly or disassembly. Observe the following precautions when handling the LCD module: 1.
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Appendices Appendix A Handling the LCD Module 3. If the panel’s surface gets dirty, wipe it with cotton or a soft cloth. If it is still dirty, try breathing on the surface to create a light condensate and wipe it again. If the surface is very dirty, we recommend a CRT cleaning agent.
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Appendix A Handling the LCD Module Appendices 5. Glass is used in the panel, so be careful not to drop it or let it strike a hard object, which could cause breakage or cracks. 6. CMOS-LSI circuits are used in the module, so guard against damage from electrostatic discharge.
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Appendices Appendix A Handling the LCD Module 7. Do not expose the module to direct sunlight or strong ultraviolet rays for long periods. 8. Do not store the module at temperatures below specifications. Cold can cause the liquid crystals to freeze, lose their elasticity or otherwise suffer damage. 9.
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Appendix A Handling the LCD Module Appendices 10. If you transport the module, do not use packing material that contains epoxy resin (amine) or silicon glue (alcohol or oxide). These materials can release gas that can damage the panel’s polarization. TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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Appendices Appendix A Handling the LCD Module [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813 )
Appendix B Board Layout Appendices Appendix B Board Layout B.1 System board (FGQSY*/FGWSY*) Front View Figure B-1 System board (FGQSY*/FGWSY* layout (front) [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Appendices Appendix B Board Layout Table B-1 System board (FGQSY*/FGWSY*) connectors and ICs (front) Number Name CN2170 Smart Card interface connector CN2600 PCI-E MINI CARD interface connector CN3110 It is debugging port for development only CN3230 KB interface connector CN4440 Bluetooth interface connector CN5300 LCD interface connector...
Appendix B Board Layout Appendices B.2 System board (FGQSY*/FGWSY*) Back View Figure B-2 System board (FGQFS*/FGWSY*) layout (back) [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Appendices Appendix B Board Layout Table B-2 System board (FGQSY*/FGWSY*) connectors and ICs (back) Number Name CN1400 Memory A connector CN1410 Memory B connector CN1900 SATA HDD interface connector CN1950 SATA ODD interface connector CN1970 eSATA/USB interface connector CN2300 DOCKING interface connector CN4050 LAN interface connector CN3380...
Appendix B Board Layout Appendices B.5 USB board (FGQUS*/ FGWUS*) View: Non Modem model only (front) (back) Figure B-5 USB board (FGQUS*/ FGWUS* layout (front/back) Table B-5 USB board (FGQUS*/ FGWUS*) connector (front/back) Number Name CN4620 USB interface connector CN9670 System board interface connector [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Appendix C Pin Assignments Appendices Appendix C Pin Assignments System board (FGQSY*/FGWSY*) CN1400 Memory A connector(200-pin) Table C- 1 Memory A connector (200-pin) (1/3) Pin No. Signal Name Pin No. Signal Name MR0R75-B0V ADQ00-B1P ADQ05-B1P ADQ04-B1P ADQ01-B1P ADQS0-B1N ADM0-B1P ADQS0-B1P ADQ06-B1P ADQ03-B1P ADQ07-B1P...
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Appendices Appendix C Pin Assignments Table C-1 Memory A connector (200-pin) (2/3) Pin No. Signal Name Pin No. Signal Name ADQS3-B1N ADM3-B1P ADQS3-B1P ADQ31-B1P ADQ30-B1P ADQ26-B1P ADQ27-B1P ACKE0-B1P ACKE1-B1P 1R5-B1V 1R5-B1V AMA15-B1P ABS2-B1P AMA14-B1P 1R5-B1V 1R5-B1V AMA12-B1P AMA11-B1P AMA09-B1P AMA07-B1P 1R5-B1V 1R5-B1V AMA08-B1P...
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Appendix C Pin Assignments Appendices Table C-1 Memory A connector (200-pin) (3/3) Pin No. Signal Name Pin No. Signal Name ADQS4-B1N ADM4-B1P ADQS4-B1P ADQ38-B1P ADQ39-B1P ADQ35-B1P ADQ34-B1P ADQ41-B1P ADQ44-B1P ADQ40-B1P ADQ45-B1P ADQS5-B1N ADM5-B1P ADQS5-B1P ADQ47-B1P ADQ46-B1P ADQ42-B1P ADQ43-B1P ADQ53-B1P ADQ48-B1P ADQ49-B1P ADQ52-B1P ADQS6-B1N...
Appendix C Pin Assignments Appendices CN2300 DOCKING interface connector (140-pin) Table C- 7 DOCKING interface connector (140-pin) (1/3) Pin No. Signal Name Pin No. Signal Name DCOUT DCOUT DOCDT1-S3N ZUSBDC-E3P ZUSBDC-E3N ZDVTX2-P3P ZDVTX2-P3N ZDVTX1-P3P ZDVTX1-P3N DVIDET-P3N DCOUT DCOUT DPCONF-S5P XDVTCK-P3N XDVTCK-P3P ZDVTX0-P3P ZDVTX0-P3N...
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Appendices Appendix C Pin Assignments Table C-7 DOCKING interface connector (140-pin) (2/3) Pin No. Signal Name Pin No. Signal Name ZBIDCN-EXN ZBIDCP-EXP DCOUT DCOUT PWRSW-S3N DOCVON-S3P DILSON-S3P NVBBLU-PXP NVBRED-PXP NVBSDA-P3P NVBSCL-P3P ACT-E3N - - - ZBIDBN-EXN ZBIDBP-EXP ZBIDAN-EXN ZBIDAP-EXP DCOUT DCOUT EJCTRQ-S3N DHSYNC-P3P...
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Appendix C Pin Assignments Appendices Table C-7 DOCKING interface connector (140-pin) (3/3) Pin No. Signal Name Pin No. Signal Name DSKDC TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL] C-11...
Appendices Appendix C Pin Assignments C.14 CN3380 FAN interface connector (4-pin) Table C- 14 FAN interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name FANG0-P3P FPWM0-S3P C.15 CN8800 DC-IN connector (4-pin) Table C- 15 DC-IN connector (4-pin) Pin No. Signal Name Pin No.
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Appendix C Pin Assignments Appendices C.16 CN8810 Battery connector (10-pin) Table C- 16 Battery connector (10-pin) Pin No. Signal Name Pin No. Signal Name Q8811-1pin BTMP1 Q8811-4pin PSCL-S5P PSDA-S5P DBT1OV-S5N C.17 CN9540 WebCam interface connector (6-pin) Table C- 17 WebCam interface connector (6-pin) Pin No.
Appendix C Pin Assignments Appendices USB board (FGQUS*/FGWUS*) C.32 CN9670 System board interface connector (10-pin) Table C- 32 System board interface connector (10-pin) Pin No. Signal Name Pin No. Signal Name ZUSBP1-E3N ZUSBP1-E3P USB0PS-E5V USB0PS-E5V C.33 CN4620 USB interface connector (4-pin) Table C- 33 USB interface connector (4-pin) Pin No.
Appendices Appendix C Pin Assignments C.41 CN6150 Speaker interface connector (4-pin) Table C- 41 Speaker interface connector (4-pin) Pin No. Signal Name Pin No. Signal Name SPOTL-PXN SPOTL-PXP SPOTR-PXP SPOTR-PXN C.42 CN6070 Int-Mic interface connector (2-pin) Table C- 42 Int-Mic interface connector (2-pin) Pin No.
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Appendix D Keyboard Scan/Character Codes Appendices Appendix. D Appendix D Keyboard Scan/Character Codes Scan Codes Table D-1 Scan codes (set 1 and set 2) (1/4) Code set 1 Code set 2 Keytop Note Make Break Make Break ‘ ~ 7 & BkSp TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (2/4) Code set 1 Code set 2 Keytop Note Make Break Make Break Caps Lock ‘ “ Enter Shift (L) No.102 , < . > Shift (R) [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
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Appendix D Keyboard Scan/Character Codes Appendices Table D-1 Scan codes (set 1 and set 2) (3/4) Code set 1 Code set 2 Keytop Note Make Break Make Break Ctrl Alt (L) Space ALT (R) Home PgUp PgDn ...
Appendices Appendix D Keyboard Scan/Character Codes Table D-1 Scan codes (set 1 and set 2) (4/4) Code set 1 Code set 2 Keytop Note Make Break Make Break PrintSc Pause — — — — Notes: 1. * Scan codes differ by mode. 2.
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Appendix D Keyboard Scan/Character Codes Appendices Table D-2 Scan codes with left Shift key Code set 1 Code set 2 Make Break Make Break E0 AA E0 35 E0 B5 E0 2A E0 F0 12 E0 4A E0 F0 4A E0 12 E0 AA E0 52 E0 D2 E0 2A E0 F0 12 E0 70 E0 F0 70 E0 12...
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Appendices Appendix D Keyboard Scan/Character Codes Table D-3 Scan codes in Numlock mode Code set 1 Code set 2 Make Break Make Break E0 2A E0 52 E0 D2 E0 AA E0 12 70 E0 F0 E0 F0 12 E0 2A E0 53 E0 D3 E0 AA E0 12 71 E0 F0 E0 F0 12...
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Appendix D Keyboard Scan/Character Codes Appendices Table D-5 Scan codes in overlay mode Code set 1 Code set 2 Keytop Make Break Make Break (–) Table D-6 No.124 key scan code Code set 1 Code set 2 Shift Make Break Make Break Prt Sc...
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Appendices Appendix D Keyboard Scan/Character Codes Table D-7 No.126 key scan code Shift Code set 1 Code set 2 Make Make Pause Common* E1 1D E1 F0 Ctrl* E0 46 7E E0 F0 *: This key generates only make codes. [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Appendix E Key Layout Appendices Appendix E Key Layout United Kingdom (UK) Keyboard Figure E-1 UK keyboard United States (US) Keyboard Figure E-2 US keyboard TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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Appendices Appendix E Key Layout [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Appendix G BIOS rewrite procedures Appendices Appendix G Appendix G BIOS Rewrite Procedures This Appendix explains how to rewrite the system BIOS program when you update the system BIOS. Tools To rewrite the BIOS, you need the following tool: BIOS/EC/KBC rewriting disk Rewriting the BIOS 1.
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Appendices Appendix G BIOS rewrite procedures [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813 )
Appendix H EC/KBC rewrite procedures Appendices Appendix H Appendix H EC/KBC Rewrite Procedures This Appendix explains how to rewrite the EC/KBC system program when you update the EC/KBC system. It is necessary to rewrite the EC/KBC system program when the following changes are made. 1.
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Appendices Appendix H EC/KBC rewrite procedures [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)
Appendix I Reliability Appendices Appendix I Reliability Appendix I Reliability The following table shows MTBF (Mean Time Between Failures) in maximum configuration. Table I-1 MTBF Time (hours) 5422.6h 10GC 5392.5h TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813) [CONFIDENTIAL]...
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Appendices Appendix I Reliability [CONFIDENTIAL] TECRA M11/Satellite Pro S500M Series Maintenance Manual (960-813)