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Diagonal 8mm (Type 1/2) CCD Image Sensor for EIA B/W Video Cameras
Description
The ICX418ALB is an interline CCD solid-state
image sensor suitable for EIA B/W video cameras
with a diagonal 8mm (Type 1/2) system. Compared
with the current product ICX038DLB, basic
characteristics such as sensitivity, smear, dynamic
range and S/N are improved drastically.
This chip features a field period readout system and
an electronic shutter with variable charge-storage
time. Also, this outline is miniaturized by using
original package. This chip is compatible with the
pins of the ICX038DLB and has the same drive
conditions.
Features
• High sensitivity (+5.0dB compared with the ICX038DLB)
• Low smear (–5.0dB compared with the ICX038DLB
• High D range (+2.0dB compared with the ICX038DLB)
• High S/N
• High resolution and low dark current
• Excellent antiblooming characteristics
• Continuous variable-speed shutter
• Substrate bias:
• Reset gate pulse:
• Horizontal register:
• Maximum package dimensions: 13.2mm
Device Structure
• Interline CCD image sensor
• Optical size:
• Number of effective pixels: 768 (H)
• Total number of pixels:
• Chip size:
• Unit cell size:
• Optical black:
• Number of dummy bits:
• Substrate material:
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by
any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the
operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
Adjustment free (external adjustment also possible with 6 to 14V)
5Vp-p adjustment free (drive also possible with 0 to 9V)
5V drive
Diagonal 8mm (Type 1/2)
494 (V) approx. 380K pixels
811 (H)
508 (V) approx. 410K pixels
7.40mm (H)
5.95mm (V)
8.4µm (H)
9.8µm (V)
Horizontal (H) direction: Front 3 pixels, rear 40 pixels
Vertical (V) direction:
Horizontal 22
Vertical 1 (even fields only)
Silicon
– 1 –
ICX418ALB
16 pin DIP (Ceramic)
V
3
Pin 9
Optical black position
Front 12 pixels, rear 2 pixels
Pin 1
2
12
H
40
(Top View)
E01908A41
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Related Manuals for Sony ICX418ALB
Summary of Contents for Sony ICX418ALB
- Page 1 Silicon Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices.
- Page 2 Notice which will be available to you in the latest specifications book for the Products. You should abide by the latest version of this Notice. If a Sony subsidiary or distributor has its own use restriction notice on the Products, such a use restriction notice will additionally apply between you and the subsidiary or distributor.
- Page 3 Output circuit supply voltage Signal output Horizontal Register Pin No. – 3 – Note) Note) : Photo sensor Symbol Description Reset drain bias Reset gate clock Substrate bias circuit supply voltage DSUB Horizontal register transfer clock Horizontal register transfer clock ICX418ALB...
- Page 4 –0.3 to +50 –0.3 to +18 –55 to +10 –15 to +20 to +10 to +15 to +17 –17 to +17 –10 to +15 –55 to +10 –65 to +0.3 –0.3 to +30 –30 to +80 °C –10 to +60 °C ICX418ALB...
- Page 5 = 9.0V Symbol Min. Typ. – 5 – Typ. Max. Unit Remarks 15.0 15.45 15.0 15.45 15.45 15.0 Typ. Max. Unit Remarks 15.0 15.45 15.0 15.45 14.0 10.5 11.0 11.5 12.0 12.5 13.0 Max. Unit Remarks 10.0 ICX418ALB 13.5 14.0...
- Page 6 Vp-p Min. Typ. Max. Unit –0.2 Vp-p – 6 – Waveform Remarks diagram = (V = (V n – V High-level coupling High-level coupling Low-level coupling Low-level coupling Low-level coupling Waveform Remarks diagram ICX418ALB n (n = 1 to 4)
- Page 7 Capacitance between reset gate clock and GND Capacitance between substrate clock and GND Vertical transfer clock series resistor Vertical transfer clock ground resistor Vertical transfer clock equivalent circuit Symbol Horizontal transfer clock equivalent circuit – 7 – Min. Typ. Max. Unit 2700 2700 ICX418ALB Remarks...
- Page 8 Drive Clock Waveform Conditions (1) Readout clock waveform 100% (2) Vertical transfer clock waveform = (V = (V n – V n (n = 1 to 4) – 8 – ICX418ALB...
- Page 9 Negative overshoot level during the falling edge of RG is V (5) Substrate clock waveform 100% Point A is the minimum value of the coupling waveform during the period from RGLL RGLm – 9 – ICX418ALB + 0.5V is the average value of V RGLH...
- Page 10 Typ. Max. Min. Typ. Max. Min. Typ. Max. Min. Typ. Max. 5.38 5.38 Min. Typ. Max. – 10 – Unit µs During readout 0.01 0.01 µs 0.01 0.01 When draining µs charge Unit Remarks and H is two. ICX418ALB Remarks...
- Page 11 Effective pixel region Min. Typ. Max. Unit 1100 1000 –115 –105 494 (V) Ignored region – 11 – (Ta = 25°C) Measurement Remarks method Ta = 60°C Zone 0 and I Zone 0 to II' Ta = 60°C Ta = 60°C ICX418ALB...
- Page 12 (Vmin [mV]) values of the signal output and substitute the values into the following formula. SH = (Vmax – Vmin)/200 100 [%] , color temperature of 3200K halogen source) as a subject. (Pattern [dB] (1/10V method conversion value) – 12 – ICX418ALB...
- Page 13 Adjust the signal output value generated by strobe light to 200mV. After setting the strobe light so that it strobes with the following timing, measure the residual signal (Vlag). Substitute the value into the following formula. Lag = (Vlag/200) 100 [%] Light Strobe light timing Output signal output 200mV Ylag (lag) – 13 – ICX418ALB...
- Page 14 Drive Circuit 1 (substrate bias internal generation mode) XSUB CXD1267AN XSG1 XSG2 22/20V 100k 1/35V 22/16V 0.01 0.01 3.3/20V ICX418 (BOTTOM VIEW) 0.01 [ A] CCD OUT 3.9k –9V 3.3/16V...
- Page 15 Drive Circuit 2 (substrate bias external adjustment mode) XSUB CXD1267AN XSG1 XSG2 22/20V 1/35V 1/35V 100k 1/35V 22/16V 0.01 270k 0.01 3.3/20V ICX418 (BOTTOM VIEW) 0.01 [ A] CCD OUT 3.9k –9V 3.3/16V...
- Page 16 Spectral Sensitivity Characteristics (Excludes lens characteristics and light source characteristics) Sensor Readout Clock Timing Chart Odd Field Even Field Wave Length [nm] 2.5 2.5 2.5 33.5 – 16 – 1000 Unit: µs ICX418ALB...
- Page 17 Drive Timing Chart (Vertical Sync) 2 4 6 1 3 5 2 4 6 1 3 5...
- Page 18 Drive Timing Chart (Horizontal Sync)
- Page 19 5) Exposure to high temperature or humidity will affect the characteristics. Accordingly avoid storage or usage in such conditions. 6) CCD image sensors are precise optical equipment that should not be subject to too much mechanical shocks. – 19 – ICX418ALB...
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Page 20: Package Structure
Package Outline Unit: mm 1.84 6.175 1st. pin Index 12.0 ± 0.15 12.35 ± 0.3 1.27 PACKAGE STRUCTURE Ceramic PACKAGE MATERIAL LEAD TREATMENT GOLD PLATING LEAD MATERIAL 42 ALLOY PACKAGE MASS 0.90g DRAWING NUMBER AS-B4-01(E) 16 pin DIP (300mil) 3.29 ± 0.3 2.54 1.