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MicroHarmony Cell Sizes 40 - 260A Manual
1.2.8
Heat Sink Design
The heat sink assembly is designed for optimum IGBT cooling. The modules are arranged close together to reduce
size. The IGBTs are separated for input/output bus locations and to increase thermal performance. The heat sink is a
high performance, low pressure drop, light-weight aluminum design with a very thin base plate. A low pressure drop
mechanically swagged hollow fin design is offered that eliminates the thermal impedance of glue used in
conventional bonded fin designs.
1.2.9
Enclosure
The cell is enclosed in a solid hot-dipped galvanized steel chassis. In the event of a catastrophic failure, the damage
is contained to the faulted cell, protecting adjacent cells from any collateral damage. The top of the cell can be
removed for heat sink and capacitor access. The bottom of the cell houses the cell control board and can be easily
removed.
1.2.10 Increased input voltage rating
All MicroHarmony cells operate with a nominal 750Vrms input. This allows a 9-cell system to produce a 4160V
motor voltage with only 9 cells. Overmodulation is also used to increase the output voltage capability.
1.2.11 Multiple Sources
At least 2 sources for all components are standard on MicroHarmony cells. This encourages good quality control,
lowest cost, and shortest lead times.
1.2.12 Simple Design
The cell was designed with easier assembly, access, and troubleshooting in mind.
1.2.13 Electrolytic Capacitors with Plastic Mounting Tray
Economical 450V, 5600μF (40-140A) 10000μF (200-260A) electrolytic capacitors are used together with a simple
snap-in mounting tray for easy assembly.
19001467: Version 1.0
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Cell Overview
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